TY - GEN
T1 - Physical Based Model of Air-Cooled Thermosyphon
AU - Huang, Po Jui
AU - Lin, Hao Yu
AU - Rukruang, Amawasee
AU - Wang, Chi Chuan
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This study developed a numerical model applicable to air-cooled thermosyphon. The thermosyphon consisted of flat tubes with multiport microchannels in a parallel configuration. The flat tubes were embedded in a heated block at the evaporator, and only one side of the heating block was attached to the heat source. The air-cooled condenser was covered with louver fins with airflow passing through. The model incorporated various heat transfer mechanisms, including falling film condensation and evaporation, nucleate boiling, conduction, and thermal spreading. The analysis was conducted with frontal velocity across the condenser ranging from 0.5 m/s to 4 m/s, filling ratios of 20% to 60%, the heating power of 110 W to 330 W, and geometric influences of thermosyphon such as heater and fin. The result reveals that the total thermal resistance decreases with the rise of power and air flow rate, which spans from 0.03 to 0.05 K/W. For further elaboration of the prediction, it is found that the thermal resistance decreases with a decreasing filling ratio. The pressure drop increases with a rising air flow rate ranging from 10 Pa to 120 Pa. Besides, the power variation imposes a negligible effect on the airside pressure drop. Finally, the current model gives uniform underprediction on the experimental data, and an optimal filling ratio is presented. The pressure drop prediction reveals a low prediction error of 7%.
AB - This study developed a numerical model applicable to air-cooled thermosyphon. The thermosyphon consisted of flat tubes with multiport microchannels in a parallel configuration. The flat tubes were embedded in a heated block at the evaporator, and only one side of the heating block was attached to the heat source. The air-cooled condenser was covered with louver fins with airflow passing through. The model incorporated various heat transfer mechanisms, including falling film condensation and evaporation, nucleate boiling, conduction, and thermal spreading. The analysis was conducted with frontal velocity across the condenser ranging from 0.5 m/s to 4 m/s, filling ratios of 20% to 60%, the heating power of 110 W to 330 W, and geometric influences of thermosyphon such as heater and fin. The result reveals that the total thermal resistance decreases with the rise of power and air flow rate, which spans from 0.03 to 0.05 K/W. For further elaboration of the prediction, it is found that the thermal resistance decreases with a decreasing filling ratio. The pressure drop increases with a rising air flow rate ranging from 10 Pa to 120 Pa. Besides, the power variation imposes a negligible effect on the airside pressure drop. Finally, the current model gives uniform underprediction on the experimental data, and an optimal filling ratio is presented. The pressure drop prediction reveals a low prediction error of 7%.
KW - aircooling
KW - falling-film condensation
KW - louver fin
KW - microchannel
KW - thermosyphon
UR - http://www.scopus.com/inward/record.url?scp=85207820983&partnerID=8YFLogxK
U2 - 10.1109/ITherm55375.2024.10709477
DO - 10.1109/ITherm55375.2024.10709477
M3 - Conference contribution
AN - SCOPUS:85207820983
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
BT - Proceedings of the 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024
PB - IEEE Computer Society
T2 - 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024
Y2 - 28 May 2024 through 31 May 2024
ER -