PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING

Whit Vinson; David Huitink

doi:10.1115/IPACK2023-111909

PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING

Whit Vinson
, David Huitink

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The results contained within this paper examine the combined influence of electromigration stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder joints (300[μm] diameter) compared to either individual stress condition acting singularly. Tensile stresses of 0 to 5 [MPa] were applied to samples already experiencing electromigration conditions of 9,100 [A/cm²] (4.611 [A]) at ambient temperatures of 100 and 150 [°C]. The testing duration was limited to 48 hours per sample. All samples tested without an applied tensile stress (i.e. 0 [MPa]) survived the 48 hour period. The same was true for only five of 24 samples tested under combined electromigration and tensile stressing conditions. Post failure analysis of the samples tested under combined electromigration and tensile stress showed necking or breakage at the Cu/SAC305 interface on the upstream side of electron flux. Cross-sectional analysis of tested samples is consistent with findings from other studies regarding electromigration failure in Cu/SAC305/Cu solder joint assemblies, where the intermetallic regions at Cu/SAC305 interfaces grow asymmetrically. Inherent process-voids in the experimental samples are discussed as a source of error and a brief computational examination of the impact of process-related voiding on current density and self-heating within solder samples is provided.

Original language	English
Title of host publication	Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023
Publisher	American Society of Mechanical Engineers
ISBN (Electronic)	9780791887516
DOIs	https://doi.org/10.1115/IPACK2023-111909
State	Published - 2023
Externally published	Yes
Event	ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023 - San Diego, United States Duration: Oct 24 2023 → Oct 26 2023

Publication series

Name	Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023

Conference

Conference	ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023
Country/Territory	United States
City	San Diego
Period	10/24/23 → 10/26/23

Funding

The authors would like to thank the Defense Established Program to Stimulate Competitive Research and the Office of Naval Research (Contract No.: FA9550-21-1-0205, DCN# 543-686-23) for funding and guidance to make this study possible. The authors would also like to the University of Arkansas College of Engineering and Mechanical Engineering department as well as the High Density Electronics Center for access to facilities, equipment, and resources needed for the creation of this study. Any opinions, findings, and conclusions or recommendations expressed in this content are those of the author(s) and do not necessarily reflect the views of the Office of Naval Research.

Keywords

Combined stress failure
Electromigration
Mechanical stress
SAC305 solder

Access to Document

10.1115/IPACK2023-111909

Cite this

Vinson, W., & Huitink, D. (2023). PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING. In Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023 Article v001t02a007 (Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023). American Society of Mechanical Engineers. https://doi.org/10.1115/IPACK2023-111909

Vinson, Whit ; Huitink, David. / PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING. Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023. American Society of Mechanical Engineers, 2023. (Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023).

@inproceedings{cc0555bd9d2e49e7b3f5c37b82c38334,

title = "PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING",

abstract = "The results contained within this paper examine the combined influence of electromigration stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder joints (300[μm] diameter) compared to either individual stress condition acting singularly. Tensile stresses of 0 to 5 [MPa] were applied to samples already experiencing electromigration conditions of 9,100 [A/cm2] (4.611 [A]) at ambient temperatures of 100 and 150 [°C]. The testing duration was limited to 48 hours per sample. All samples tested without an applied tensile stress (i.e. 0 [MPa]) survived the 48 hour period. The same was true for only five of 24 samples tested under combined electromigration and tensile stressing conditions. Post failure analysis of the samples tested under combined electromigration and tensile stress showed necking or breakage at the Cu/SAC305 interface on the upstream side of electron flux. Cross-sectional analysis of tested samples is consistent with findings from other studies regarding electromigration failure in Cu/SAC305/Cu solder joint assemblies, where the intermetallic regions at Cu/SAC305 interfaces grow asymmetrically. Inherent process-voids in the experimental samples are discussed as a source of error and a brief computational examination of the impact of process-related voiding on current density and self-heating within solder samples is provided.",

keywords = "Combined stress failure, Electromigration, Mechanical stress, SAC305 solder",

author = "Whit Vinson and David Huitink",

note = "Publisher Copyright: Copyright {\textcopyright} 2023 by ASME.; ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023 ; Conference date: 24-10-2023 Through 26-10-2023",

year = "2023",

doi = "10.1115/IPACK2023-111909",

language = "English",

series = "Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023",

publisher = "American Society of Mechanical Engineers",

booktitle = "Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023",

}

Vinson, W & Huitink, D 2023, PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING. in Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023., v001t02a007, Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023, American Society of Mechanical Engineers, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023, San Diego, United States, 10/24/23. https://doi.org/10.1115/IPACK2023-111909

PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING. / Vinson, Whit; Huitink, David.
Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023. American Society of Mechanical Engineers, 2023. v001t02a007 (Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING

AU - Vinson, Whit

AU - Huitink, David

PY - 2023

Y1 - 2023

N2 - The results contained within this paper examine the combined influence of electromigration stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder joints (300[μm] diameter) compared to either individual stress condition acting singularly. Tensile stresses of 0 to 5 [MPa] were applied to samples already experiencing electromigration conditions of 9,100 [A/cm2] (4.611 [A]) at ambient temperatures of 100 and 150 [°C]. The testing duration was limited to 48 hours per sample. All samples tested without an applied tensile stress (i.e. 0 [MPa]) survived the 48 hour period. The same was true for only five of 24 samples tested under combined electromigration and tensile stressing conditions. Post failure analysis of the samples tested under combined electromigration and tensile stress showed necking or breakage at the Cu/SAC305 interface on the upstream side of electron flux. Cross-sectional analysis of tested samples is consistent with findings from other studies regarding electromigration failure in Cu/SAC305/Cu solder joint assemblies, where the intermetallic regions at Cu/SAC305 interfaces grow asymmetrically. Inherent process-voids in the experimental samples are discussed as a source of error and a brief computational examination of the impact of process-related voiding on current density and self-heating within solder samples is provided.

AB - The results contained within this paper examine the combined influence of electromigration stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder joints (300[μm] diameter) compared to either individual stress condition acting singularly. Tensile stresses of 0 to 5 [MPa] were applied to samples already experiencing electromigration conditions of 9,100 [A/cm2] (4.611 [A]) at ambient temperatures of 100 and 150 [°C]. The testing duration was limited to 48 hours per sample. All samples tested without an applied tensile stress (i.e. 0 [MPa]) survived the 48 hour period. The same was true for only five of 24 samples tested under combined electromigration and tensile stressing conditions. Post failure analysis of the samples tested under combined electromigration and tensile stress showed necking or breakage at the Cu/SAC305 interface on the upstream side of electron flux. Cross-sectional analysis of tested samples is consistent with findings from other studies regarding electromigration failure in Cu/SAC305/Cu solder joint assemblies, where the intermetallic regions at Cu/SAC305 interfaces grow asymmetrically. Inherent process-voids in the experimental samples are discussed as a source of error and a brief computational examination of the impact of process-related voiding on current density and self-heating within solder samples is provided.

KW - Combined stress failure

KW - Electromigration

KW - Mechanical stress

KW - SAC305 solder

UR - https://www.scopus.com/pages/publications/85179629014

U2 - 10.1115/IPACK2023-111909

DO - 10.1115/IPACK2023-111909

M3 - Conference contribution

AN - SCOPUS:85179629014

T3 - Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023

BT - Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023

PB - American Society of Mechanical Engineers

T2 - ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023

Y2 - 24 October 2023 through 26 October 2023

ER -

Vinson W, Huitink D. PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING. In Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023. American Society of Mechanical Engineers. 2023. v001t02a007. (Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023). doi: 10.1115/IPACK2023-111909

PERFORMANCE OF SAC305 SOLDER JOINTS UNDER SIMULTANEOUS TENSILE AND ELECTROMIGRATION STRESSING

Abstract

Publication series

Conference

Funding

Keywords

Access to Document

Other files and links

Fingerprint

Cite this