Performance evaluation of high-speed interconnects using dense communication patterns

R. Fatoohi, K. Kardys, S. Koshy, S. Sivaramakrishnan, J. S. Vetter

Research output: Contribution to journalConference articlepeer-review

3 Scopus citations

Abstract

We study the performance of high-speed interconnects using a set of communication micro-benchmarks. The goal is to identify certain limiting factors and bottlenecks with these interconnects. Our micro-benchmarks are based on dense communication patterns with different communicating partners and varying degrees of these partners. We tested our micro-benchmarks on five platforms: an IBM system of 68-node 16-way Power3, interconnected by a SP switch2; another IBM system of 264-node 4-way Power PC 604e, interconnected by a SP switch; a Compaq cluster of 128-node 4-way ES40/EV67 processor, interconnected by an Quadrics interconnect; an Intel cluster of 16-node dual-CPU Xeon, interconnected by an Quadrics interconnect; and a cluster of 22-node Sun Ultra Sparc, interconnected by an Ethernet network. Our results show many limitations of these networks including the memory contention within a node as the number of communicating processors increased and the limitations of the network interface for communication between multiple processors of different nodes.

Original languageEnglish
Article number1488742
Pages (from-to)554-561
Number of pages8
JournalProceedings of the International Conference on Parallel Processing Workshops
Volume2005
DOIs
StatePublished - 2005
EventInternational Conference on Parallel Processing Workshops 2005, ICPP 2005 - Oslo, Norway
Duration: Jun 14 2005Jun 17 2005

Funding

Part of this work was performed under the auspices of the US Dept. of Energy by University of California LLNL under contract W-7405-Eng-48.

FundersFunder number
U.S. Department of Energy
University of CaliforniaW-7405-Eng-48

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