Abstract
We study the performance of high-speed interconnects using a set of communication micro-benchmarks. The goal is to identify certain limiting factors and bottlenecks with these interconnects. Our micro-benchmarks are based on dense communication patterns with different communicating partners and varying degrees of these partners. We tested our micro-benchmarks on five platforms: an IBM system of 68-node 16-way Power3, interconnected by a SP switch2; another IBM system of 264-node 4-way Power PC 604e, interconnected by an SP switch; a Compaq cluster of 128-node 4-way ES40/EV67 processor, interconnected by an Quadrics interconnect; an Intel cluster of 16-node dual-CPU Xeon, interconnected by an Quadrics interconnect; and a cluster of 22-node Sun Ultra Sparc, interconnected by an Ethernet network. Our results show many limitations of these networks including the memory contention within a node as the number of communicating processors increased and the limitations of the network interface for communication between multiple processors of different nodes.
Original language | English |
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Pages (from-to) | 794-807 |
Number of pages | 14 |
Journal | Parallel Computing |
Volume | 32 |
Issue number | 11-12 |
DOIs | |
State | Published - Dec 2006 |
Funding
Part of this work was performed under the auspices of the US Dept. of Energy by University of California LLNL under contract W-7405-Eng-48.
Keywords
- Interconnect architecture
- Micro-benchmarks
- Pair-wise communication
- Performance evaluation