Performance analysis of single-phase immersion cooling system of data center using FC-40 dielectric fluid

M. Muneeshwaran, Yueh Cheng Lin, Chi Chuan Wang

Research output: Contribution to journalArticlepeer-review

26 Scopus citations

Abstract

Immersion cooling technologies have become an emerging cooling method for data center cooling. The studies available in open literature dealt with immersion cooling performance of data servers using mineral oil, EC-100, and Opticool 872552, but the studies focusing on the performance of FC-40 dielectric fluid is not available. Therefore, this study aimed to develop a single-phase liquid immersion cooling system using FC-40 dielectric fluid for a 1U (44.45 mm height) data server. The present study experimentally investigated the influence of different design and operating parameters, including the inlet/outlet port configuration (T and Z configurations), the bypass effect, the flowrate (1–3 LPM), the heating load (200–600 W), the inlet fluid temperature (15–35 °C), the presence of suction fan with various arrangements, and different heat sink bases (solid base, vapor chamber and heat pipe base). The results showed that the T-configuration could provide a 12.6% and 0.5–2.8 °C reduction in thermal resistance and case temperature compared to the Z-configuration, respectively. Furthermore, the heat sink with heat pipe and vapor chamber base offered a minimum case temperature of 56.7 °C and 55.2 °C against the 60 °C experienced in the heat sink with flat plate base, respectively.

Original languageEnglish
Article number106843
JournalInternational Communications in Heat and Mass Transfer
Volume145
DOIs
StatePublished - Jun 2023

Funding

The authors appreciate the financial support from Intel Corp. and the partial support from the National Science and Technology Council Taiwan , under contract no. 111-2811-E-A49-513 -MY3 .

FundersFunder number
Intel Corporation
National Science and Technology Council111-2811-E-A49-513 -MY3

    Keywords

    • Data center
    • Dielectric fluid
    • Heat sink
    • Single-phase liquid immersion cooling
    • Thermal resistance

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