Peierls barrier characteristic and anomalous strain hardening provoked by dynamic-strain-aging strengthening in a body-centered-cubic high-entropy alloy

S. Y. Chen, L. Wang, W. D. Li, Y. Tong, K. K. Tseng, C. W. Tsai, J. W. Yeh, Y. Ren, W. Guo, J. D. Poplawsky, P. K. Liaw

Research output: Contribution to journalArticlepeer-review

34 Scopus citations

Abstract

The temperature effect on the mechanical behavior of the HfNbTaTiZr high entropy alloy (HEA) was investigated at 77–673 K. The decrease of the yield strength with increasing the temperature was mechanistically analyzed by considering contributions from various strengthening mechanisms. An anomalous dependence of strain hardening on temperature was observed and was justified to be caused by dynamic strain aging (DSA) as an extra strengthening mechanism at elevated temperatures. A model was constructed to split the overall strain hardening into forest hardening and DSA hardening, both of which were theoretically quantified at all temperatures considered.

Original languageEnglish
Pages (from-to)475-481
Number of pages7
JournalMaterials Research Letters
Volume7
Issue number12
DOIs
StatePublished - 2019

Funding

We are grateful for the financial support of the National Science Foundation of US (DMR-1611180 and 1809640), the U.S. Army Research Office project (W911NF-13-1-0438 and W911NF-19-2-0049) with the program managers, Drs. G. Shiflet, D. Farkas, M. P. Bakas, S. N. Mathaudhu, and D. M. Stepp, in US, and theMinistry of Science and Technology (MOST 107-3017-F-007-003) in Taiwan. APT was conducted at ORNL's Center for Nanophase Materials Sciences (CNMS), which is a U.S. DOE Office of Science User Facility. This research used resources of the Advanced Photon Source, a U.S. Department of Energy (DOE) Office of Science User Facility operated for the DOE Office of Science by Argonne National Laboratory under Contract No. DE-AC02-06CH11357.

Keywords

  • Strain hardening
  • dislocation width
  • dynamic strain aging
  • serrated flow
  • temperature dependence

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