Fingerprint
Dive into the research topics of 'Packaging of high-temperature power semiconductor modules'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Packaging of high-temperature power semiconductor modules
- S. S. Ang
- , B. L. Rowden
- , J. C. Balda
- , H. A. Mantooth
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
4
Scopus
citations