@inproceedings{a2c7aec1e72f4a0f96ccfe379bfb64b7,
title = "Packaging of high-temperature power semiconductor modules",
abstract = "The requirements of higher operating temperatures for power semiconductor modules require substantial changes to conventional power module fabrication techniques. This paper discusses the selection of substrates, die attachment methods, assembly and package housing for high-temperature power module. A transient liquid phase die attachment method has been demonstrated using two binary alloy systems of Ag-Sn and Ag-In. High-temperature power modules have been fabricated to illustrate the feasibility of the proposed fabrication methods.",
author = "Ang, \{S. S.\} and Rowden, \{B. L.\} and Balda, \{J. C.\} and Mantooth, \{H. A.\}",
year = "2010",
doi = "10.1149/1.3360729",
language = "English",
isbn = "9781607682639",
series = "ECS Transactions",
publisher = "Electrochemical Society Inc.",
number = "1",
pages = "909--914",
booktitle = "China Semiconductor Technology International Conference 2010, CSTIC 2010",
edition = "1",
note = "China Semiconductor Technology International Conference 2010, CSTIC 2010 ; Conference date: 18-03-2010 Through 19-03-2010",
}