@inproceedings{eb3770ea8972423f82c5137ba53ac293,
title = "Packaging issues for high-voltage power electronic modules",
abstract = "This paper addresses interconnect and passivation issues associated with the fabrication of high-voltage power electronic modules. A wire-bondless direct solder attachment hierarchy for interconnection was evaluated using two direct-bond copper (DBC) elements: one acting as a substrate connected to a base plate and the second as an interconnection lead-frame between the power semiconductor devices. Finite element modeling revealed their enhanced performance over wire-bonded modules due to at least an order of magnitude decrease in parasitic inductance and the added benefit of enhanced thermal performance. A two-step passivationZencapsulation method to provide higher breakdown voltages at high temperatures is proposed for future high-voltage power electronic modules.",
author = "Ang, {S. S.} and T. Evans and J. Zhou and K. Schirmer and H. Zhang and B. Rowden and Balda, {J. C.} and Mantooth, {H. A.}",
year = "2011",
doi = "10.1149/1.3567688",
language = "English",
isbn = "9781607682356",
series = "ECS Transactions",
number = "1",
pages = "893--898",
booktitle = "China Semiconductor Technology International Conference 2011, CSTIC 2011",
edition = "1",
note = "10th China Semiconductor Technology International Conference 2011, CSTIC 2011 ; Conference date: 13-03-2011 Through 14-03-2011",
}