TY - GEN
T1 - Operating parameter based wirebond model for a power module
AU - Reddy, Lakshmi Gopi
AU - Tolbert, Leon M.
AU - Ozpineci, Burak
PY - 2014
Y1 - 2014
N2 - Lifetime estimation of power semiconductors for various applications has gained technical importance. The main failures in high power semiconductors are caused by thermo-mechanical fatigue, mainly in solder and wirebonds, due to different coefficients of thermal expansions of the various packaging materials. Most of the lifetime models do not take all the operating parameters into account. There is a need to develop a generalized lifetime model specific to failure mechanisms that account for all of the operating parameters in an application. This paper presents finite element based stress simulations for varying operating parameters (current, temperature, etc.) for a fixed dimension wire.
AB - Lifetime estimation of power semiconductors for various applications has gained technical importance. The main failures in high power semiconductors are caused by thermo-mechanical fatigue, mainly in solder and wirebonds, due to different coefficients of thermal expansions of the various packaging materials. Most of the lifetime models do not take all the operating parameters into account. There is a need to develop a generalized lifetime model specific to failure mechanisms that account for all of the operating parameters in an application. This paper presents finite element based stress simulations for varying operating parameters (current, temperature, etc.) for a fixed dimension wire.
UR - http://www.scopus.com/inward/record.url?scp=84900415342&partnerID=8YFLogxK
U2 - 10.1109/APEC.2014.6803813
DO - 10.1109/APEC.2014.6803813
M3 - Conference contribution
AN - SCOPUS:84900415342
SN - 9781479923250
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 3502
EP - 3506
BT - APEC 2014 - 29th Annual IEEE Applied Power Electronics Conference and Exposition
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2014
Y2 - 16 March 2014 through 20 March 2014
ER -