Abstract
The effect of a thin Ti alloy metallization layer sputtered on a Si wafer on the crack sizes associated with the indents was studied. The interaction between cracks emanating from sequentially placed indentations was also assessed. The distance between the indents which generated these cracks was varied from a level comparable to the crack size to a level where interaction was ignored.
| Original language | English |
|---|---|
| Pages (from-to) | 337-342 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 516 |
| DOIs | |
| State | Published - 1998 |
| Externally published | Yes |
| Event | Proceedings of the 1998 MRS Spring Meeting - San Francisco, CA, USA Duration: Apr 13 1998 → Apr 16 1998 |