On the influence of titanium alloy composition and layer thickness on the mechanical properties of a polyimide substrate

G. Muralidharan, B. Narayanan, C. C. Wong, M. Manoharan

Research output: Contribution to journalConference articlepeer-review

5 Scopus citations

Abstract

Metal-polymer bilayers and multilayers are being increasingly used in the microelectronics industry. In many cases, the reliability of the device or the package is determined by the mechanical behavior of these composite layers. Finite element analyses are being widely used to model these systems. An accurate experimental understanding of the mechanical behavior of these systems would further enhance the usefulness of such analyses. The present study focuses on the mechanical behavior of composite bilayers consisting of polyimide and sputtered Ti and Ti alloy thin films. Tensile tests and stretch-deformation tests have been performed on bilayers consisting of a polyimide substrate sputter-coated individually with a 50 nm and a 500 nm Ti layer, a 500 nm Ti-Cu layer, and a 500 nm Ti-Ni layer. Tensile moduli, stresses for 0.2%, 2% and 15% offset strains, and strains to failure have been obtained and compared. These values are discussed with reference to the known mechanical properties of the individual layers in the composite material.

Original languageEnglish
Pages (from-to)203-208
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume515
DOIs
StatePublished - 1998
Externally publishedYes
EventProceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
Duration: Apr 13 1998Apr 15 1998

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