Non-diffusive heat transport in twin nanoheater lines on silicon

Amirkoushyar Ziabari, Alex Shakouri, Yi Xuan, Je Hyeong Bahk, Yeerui Koh, Mengwei Si, Peide Ye, Ali Shakouri

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

As the size of electric and optoelectronic devices is reduced to nanoscale, self-heating becomes a major reliability concern. Leveraging designs that could intrinsically remove or reduce the heat and in turn decrease temperature is desirable. In this work, twin nanoscale heater lines with four-probe electrical measurement combined with full-field thermal imaging are used to elucidate the departure from Fourier Law. Thermoreflectance thermal imaging is employed to obtain temperature distribution of twin nanoheater lines where one is a heat source and the second one is a thermometer. The temperature change, due to Joule heating, on the heater line as well as the temperature profile on the thermometer line 0.3-0.5gm away, is measured by thermoreflectance imaging. The average temperature change of the heater lines is also measured independently using temperature-dependent electrical resistivity. Experimental results suggest that the modified Fourier theory ceases to explain the thermal distribution of submicron size heat sources. As the width of heat sources decreases, the temperature of the heater lines exceeds predictions of Fourier equation while the temperature on the thermometer line is significantly lower than the Fourier prediction. This could potentially be beneficial in the design of compact multi-finger high power transistor structures.

Original languageEnglish
Title of host publicationProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages334-338
Number of pages5
ISBN (Electronic)9781509029945
DOIs
StatePublished - Jul 25 2017
Externally publishedYes
Event16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 - Orlando, United States
Duration: May 30 2017Jun 2 2017

Publication series

NameProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017

Conference

Conference16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
Country/TerritoryUnited States
CityOrlando
Period05/30/1706/2/17

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