Abstract
Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at CERN. Results on charge collection, spatial resolution, efficiency and the charge carrier lifetime are presented.
Original language | English |
---|---|
Pages (from-to) | 153-159 |
Number of pages | 7 |
Journal | Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment |
Volume | 501 |
Issue number | 1 |
DOIs | |
State | Published - Mar 21 2003 |
Externally published | Yes |
Keywords
- Diamond
- Pixel detector