Neutron Beam Attenuation Through Semiconductor Devices during SEU Testing

S. A. Wender; J. M. O'Donnell; L. Zavorka; B. L. Bhuva

doi:10.1109/IRPS.2019.8720477

Neutron Beam Attenuation Through Semiconductor Devices during SEU Testing

S. A. Wender, J. M. O'Donnell, L. Zavorka, B. L. Bhuva

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Stacking the printed circuit boards (PCBs)populated with electronic components one behind the other during SEU tests in neutron beams is a common practice to improve the error statistics. As a result of this stacking, both neutron flux and energy spectrum change from one PCB to another, which may have a significant impact on the results of SEU tests. To quantify these impacts, we measured the neutron attenuation in a stack of test PCBs. We show that the number of transmitted neutrons exponentially decreases as the number of boards grows and we show that this transmission is energy dependent. These results will allow test engineers to correct inaccuracies in the failure-in-time (FIT)rate measurements.

Original language	English
Title of host publication	2019 IEEE International Reliability Physics Symposium, IRPS 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781538695043
DOIs	https://doi.org/10.1109/IRPS.2019.8720477
State	Published - May 22 2019
Externally published	Yes
Event	2019 IEEE International Reliability Physics Symposium, IRPS 2019 - Monterey, United States Duration: Mar 31 2019 → Apr 4 2019

Publication series

Name	IEEE International Reliability Physics Symposium Proceedings
Volume	2019-March
ISSN (Print)	1541-7026

Conference

Conference	2019 IEEE International Reliability Physics Symposium, IRPS 2019
Country/Territory	United States
City	Monterey
Period	03/31/19 → 04/4/19

Keywords

Neutron beam attenuation
Neutron radiation effects
Single event upset (SEU)testing

Access to Document

10.1109/IRPS.2019.8720477

Cite this

Wender, S. A., O'Donnell, J. M., Zavorka, L., & Bhuva, B. L. (2019). Neutron Beam Attenuation Through Semiconductor Devices during SEU Testing. In 2019 IEEE International Reliability Physics Symposium, IRPS 2019 Article 8720477 (IEEE International Reliability Physics Symposium Proceedings; Vol. 2019-March). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IRPS.2019.8720477

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title = "Neutron Beam Attenuation Through Semiconductor Devices during SEU Testing",

abstract = "Stacking the printed circuit boards (PCBs)populated with electronic components one behind the other during SEU tests in neutron beams is a common practice to improve the error statistics. As a result of this stacking, both neutron flux and energy spectrum change from one PCB to another, which may have a significant impact on the results of SEU tests. To quantify these impacts, we measured the neutron attenuation in a stack of test PCBs. We show that the number of transmitted neutrons exponentially decreases as the number of boards grows and we show that this transmission is energy dependent. These results will allow test engineers to correct inaccuracies in the failure-in-time (FIT)rate measurements.",

keywords = "Neutron beam attenuation, Neutron radiation effects, Single event upset (SEU)testing",

author = "Wender, {S. A.} and O'Donnell, {J. M.} and L. Zavorka and Bhuva, {B. L.}",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE International Reliability Physics Symposium, IRPS 2019 ; Conference date: 31-03-2019 Through 04-04-2019",

year = "2019",

month = may,

day = "22",

doi = "10.1109/IRPS.2019.8720477",

language = "English",

series = "IEEE International Reliability Physics Symposium Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Wender, SA, O'Donnell, JM, Zavorka, L & Bhuva, BL 2019, Neutron Beam Attenuation Through Semiconductor Devices during SEU Testing. in 2019 IEEE International Reliability Physics Symposium, IRPS 2019., 8720477, IEEE International Reliability Physics Symposium Proceedings, vol. 2019-March, Institute of Electrical and Electronics Engineers Inc., 2019 IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, United States, 03/31/19. https://doi.org/10.1109/IRPS.2019.8720477

Neutron Beam Attenuation Through Semiconductor Devices during SEU Testing. / Wender, S. A.; O'Donnell, J. M.; Zavorka, L. et al.
2019 IEEE International Reliability Physics Symposium, IRPS 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8720477 (IEEE International Reliability Physics Symposium Proceedings; Vol. 2019-March).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Neutron Beam Attenuation Through Semiconductor Devices during SEU Testing

AU - Wender, S. A.

AU - O'Donnell, J. M.

AU - Zavorka, L.

AU - Bhuva, B. L.

PY - 2019/5/22

Y1 - 2019/5/22

N2 - Stacking the printed circuit boards (PCBs)populated with electronic components one behind the other during SEU tests in neutron beams is a common practice to improve the error statistics. As a result of this stacking, both neutron flux and energy spectrum change from one PCB to another, which may have a significant impact on the results of SEU tests. To quantify these impacts, we measured the neutron attenuation in a stack of test PCBs. We show that the number of transmitted neutrons exponentially decreases as the number of boards grows and we show that this transmission is energy dependent. These results will allow test engineers to correct inaccuracies in the failure-in-time (FIT)rate measurements.

AB - Stacking the printed circuit boards (PCBs)populated with electronic components one behind the other during SEU tests in neutron beams is a common practice to improve the error statistics. As a result of this stacking, both neutron flux and energy spectrum change from one PCB to another, which may have a significant impact on the results of SEU tests. To quantify these impacts, we measured the neutron attenuation in a stack of test PCBs. We show that the number of transmitted neutrons exponentially decreases as the number of boards grows and we show that this transmission is energy dependent. These results will allow test engineers to correct inaccuracies in the failure-in-time (FIT)rate measurements.

KW - Neutron beam attenuation

KW - Neutron radiation effects

KW - Single event upset (SEU)testing

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Neutron Beam Attenuation Through Semiconductor Devices during SEU Testing

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