Molecular dynamics simulations of energy accommodation between gases and polymers for ultra-low thermal conductivity insulation

Tianli Feng, Amit Rai, Diana Hun, Som S. Shrestha

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Abstract

Determining the energy accommodation between gases and solids is essential to developing porous thermal insulation materials with ultra-low effective thermal conductivity that reduce energy use, greenhouse gas emissions, and fossil fuel consumption. The energy accommodation coefficients of most gases, however, have been rarely studied, especially with respect to solids that have relatively high thermal resistivity, e.g., polymers. In this work, by using all-atom nonequilibrium molecular dynamics simulations, we reveal the accommodation coefficients of He, Ar, N2, and O2 with polymers, mainly polystyrene. We find that their values are around 0.51, 0.72, 0.79, and 0.90, respectively, suggesting a critical reexamination of the commonly used theoretical maximum value of 1. We have also conducted experiments and validated the value for air, which is about 0.81. Such a change in accommodation coefficients can lead to a reduction of about 70%, 50%, 35%, and 20% in the thermal conductivity of He, Ar, N2, and O2 gases in nano pores (below 100 nm) or at low pressures (below 1 millibar). With these new accommodation coefficients, we find that in a 10 nm pore with ambient pressure at 300 K, the gas thermal conductivity of He, Ar, N2, and O2 in porous polystyrene can be as low as 9.7 × 10−4, 3.4 × 10−4, 7.3 × 10−4, and 8.5 × 10−4 W·m−1·K−1, respectively, which are two to three orders of magnitude lower than their bulk values, promising higher thermal resistivity of insulation materials. This work reveals the fundamental energy exchange between gases and polymers, providing important guidance for designing high-performance thermal insulation materials for various applications.

Original languageEnglish
Article number120459
JournalInternational Journal of Heat and Mass Transfer
Volume164
DOIs
StatePublished - Jan 2021

Funding

This work is supported by the project "Models to Evaluate and Guide the Development of Low Thermal Conductivity Materials for Building Envelopes" funded by Building Technologies Office (BTO), Office of Energy Efficiency & Renewable Energy (EERE) at the Department of Energy (DOE). Computations were performed at the National Energy Research Scientific Computing Center (NERSC), the Compute and Data Environment for Science (CADES) at Oak Ridge National Laboratory (ORNL), and the Extreme Science and Engineering Discovery Environment (XSEDE). This manuscript has been authored by UT-Battelle, LLC, under contract DE-AC05-00OR22725 with the US Department of Energy (DOE). The US Government retains and the publisher, by accepting the article for publication, acknowledges that the US government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this manuscript, or allow others to do so, for US government purposes. DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan ( http://energy.gov/downloads/doe-public-access-plan ).

Keywords

  • Accommodation coefficient
  • Amorphous polymers
  • Gaseous thermal conductivity
  • Molecular dynamics
  • Thermal insulation materials

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