Molecular dynamics for the prediction of the interfacial shear stress and interface dielectric properties of carbon fiber epoxy composites

Rajni Chahal, Ashfaq Adnan, Kenneth Reifsnider, Rassel Raihan, Yuan Ting Wu, Vamsee Vadlamudi, Muthu Ram Prabhu Elenchezhian

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

The thermoset epoxy resin Diglycidyl ether of Bisphenol F (EPON 862), crosslinked with the Diethylene Toluene Diamine (DETDA) hardening agent, are utilized as the polymer matrix component in many graphite (carbon fiber) composites. Since it is difficult to experimentally characterize the interfacial region, computational molecular modeling is a necessary tool for understanding the influence of the interfacial molecular structure on bulk-level material properties. The purpose of this research is to evaluate and compare the interfacial shear stress and dipole moment for the pristine carbon fiber composite and the one with the moisture content at the interface. Molecular models are established for Carbon fiber reinforced EPON 862-DETDA polymer with and without the moisture content at the interface. Interatomic interactions are defined by Reactive Force Field (ReaxFF). Material characteristics such as polymer mass-density and dipole moment are investigated near the polymer/fiber interface. It is determined that a region exists near the carbon fiber surface in which the polymer mass density and dipole moment are different than that of the bulk values. It can further be seen that material having larger values of dipole moment in interface region have comparatively lesser values of interfacial shear stress.

Original languageEnglish
Title of host publication33rd Technical Conference of the American Society for Composites 2018
PublisherDEStech Publications Inc.
Pages193-208
Number of pages16
ISBN (Electronic)9781510872073
StatePublished - 2018
Externally publishedYes
Event33rd Technical Conference of the American Society for Composites 2018 - Seattle, United States
Duration: Sep 24 2018Sep 27 2018

Publication series

Name33rd Technical Conference of the American Society for Composites 2018
Volume1

Conference

Conference33rd Technical Conference of the American Society for Composites 2018
Country/TerritoryUnited States
CitySeattle
Period09/24/1809/27/18

Fingerprint

Dive into the research topics of 'Molecular dynamics for the prediction of the interfacial shear stress and interface dielectric properties of carbon fiber epoxy composites'. Together they form a unique fingerprint.

Cite this