Modeling Interdiffusion Processes in CMSX-10/Ni Diffusion Couple

A. Chyrkin, A. Epishin, R. Pillai, T. Link, G. Nolze, W. J. Quadakkers

Research output: Contribution to journalArticlepeer-review

26 Scopus citations

Abstract

A diffusion couple between directionally solidified nickel and the single crystal Ni-base superalloy CMSX-10 was produced by hot pressing in vacuum. The diffusion couples were heat treated at temperatures between 1050 and 1250 °C. The exposed samples were characterized by SEM/EBSD/EPMA. The interdiffusion results in dissolution of the γ′-Ni3Al in the superalloy and in growth of nickel grains towards CMSX-10. Rapid diffusion of aluminum from the superalloy into pure nickel leads to a significant formation of pores in the superalloy. The interdiffusion processes were modelled using the finite-element simulation software DICTRA with the databases TCNi5 and MobNi2, tailored specially for Ni-base superalloys. The effect of alloying elements on the interdiffusion profiles is discussed in terms of alloy thermodynamics. The calculated element concentration profiles are in good agreement with the EPMA measurements. The interdiffusion modeling correctly predicts the shapes of the concentration profiles, e.g. kinks on the Al and Ti profiles in the vicinity of the original interface in the joint. The calculation predicts with reasonable accuracy the extent and the location of the Kirkendall porosity.

Original languageEnglish
Pages (from-to)201-211
Number of pages11
JournalJournal of Phase Equilibria and Diffusion
Volume37
Issue number2
DOIs
StatePublished - Apr 1 2016
Externally publishedYes

Keywords

  • DICTRA modeling
  • chemical potential
  • chemical potential gradients
  • composition profiles
  • diffusion
  • diffusion modeling
  • electron probe microanalysis (EPMA)

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