Skip to main navigation Skip to search Skip to main content

Modeling improvements for air-source heat pumps using different expansion devices at varied charge levels - Part II

  • Bo Shen
  • , Eckhard A. Groll
  • , James E. Braun

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    Abstract

    This paper describes steady-state performance simulations performed on a 3-ton R-22 split heat pump in heating mode. In total, 150 steady-state points were simulated, which covers refrigerant charge levels from 70% to 130% relative to the nominal value, the outdoor temperatures at 17°F (-8.3 °C), 35°F (1.7°C) and 47°F (8.3°C), indoor airflow rates from 60% to 150% of the rated airflow rate, and two types of expansion devices (fixed orifice and thermostatic expansion valve [TXV]). A charge tuning method, which is to calibrate the charge inventory model based on measurements at two operation conditions, was applied and shown to improve the system simulation accuracy significantly over an extensive range of charge levels. In addition, we discuss the effects of using a suction line accumulator in modeling a heat pump system using either a fixed orifice or thermal expansion valve. Last, we identify the issue of refrigerant mass flow mal-distribution at low charge levels and propose an improved modeling approach.

    Original languageEnglish
    Title of host publicationASHRAE Transactions - Papers Presented at the 2011 Annual Conference in Montreal, Quebec, Canada of the American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc.
    Pages552-564
    Number of pages13
    EditionPART 2
    StatePublished - 2011
    Event2011 ASHRAE Annual Conference - Montreal, QC, Canada
    Duration: Jun 25 2011Jun 29 2011

    Publication series

    NameASHRAE Transactions
    NumberPART 2
    Volume117
    ISSN (Print)0001-2505

    Conference

    Conference2011 ASHRAE Annual Conference
    Country/TerritoryCanada
    CityMontreal, QC
    Period06/25/1106/29/11

    Fingerprint

    Dive into the research topics of 'Modeling improvements for air-source heat pumps using different expansion devices at varied charge levels - Part II'. Together they form a unique fingerprint.

    Cite this