Minimum overlayer thickness for interface formation: An experimental study of the Cu/Ag/Cu(111) system

M. A. Mueller, E. S. Hirschorn, T. Miller, T. C. Chiang

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

The evolution of the electronic properties of the boundary between a solid (Ag) and an overlayer (Cu) as a function of the overlayer thickness is examined to yield the characteristic overlayer thickness for interface formation. The boundary properties are probed by measuring the reflection phase shifts of valence electrons using a quantum-well geometry.

Original languageEnglish
Pages (from-to)11825-11828
Number of pages4
JournalPhysical Review B
Volume43
Issue number14
DOIs
StatePublished - 1991
Externally publishedYes

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