Minimizing thermally induced interfacial shearing stress in a thermoelectric module

Amirkoushyar Ziabari; Ephraim Suhir; Ali Shakouri

Minimizing thermally induced interfacial shearing stress in a thermoelectric module

Amirkoushyar Ziabari, Ephraim Suhir, Ali Shakouri

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

The problem of minimizing the level of the thermally induced interfacial shearing stress in a Thermo-Electric Module (TEM) is addressed using analytical and finite-element-analysis (FEA) based modeling. The maximum stress is calculated for different leg sizes. Good agreement between the analytical and FEA predictions has been found. It is concluded that the shearing stress can be effectively minimized by using thinner legs with compliant interfaces.

Original language	English
Title of host publication	18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012
Pages	9-12
Number of pages	4
State	Published - 2012
Externally published	Yes
Event	18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012 - Budapest, Hungary Duration: Sep 25 2012 → Sep 27 2012

Publication series

Name	18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012

Conference

Conference	18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012
Country/Territory	Hungary
City	Budapest
Period	09/25/12 → 09/27/12

Cite this

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title = "Minimizing thermally induced interfacial shearing stress in a thermoelectric module",

abstract = "The problem of minimizing the level of the thermally induced interfacial shearing stress in a Thermo-Electric Module (TEM) is addressed using analytical and finite-element-analysis (FEA) based modeling. The maximum stress is calculated for different leg sizes. Good agreement between the analytical and FEA predictions has been found. It is concluded that the shearing stress can be effectively minimized by using thinner legs with compliant interfaces.",

author = "Amirkoushyar Ziabari and Ephraim Suhir and Ali Shakouri",

year = "2012",

language = "English",

isbn = "9782355000225",

series = "18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012",

pages = "9--12",

booktitle = "18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012",

note = "18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012 ; Conference date: 25-09-2012 Through 27-09-2012",

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Ziabari, A, Suhir, E & Shakouri, A 2012, Minimizing thermally induced interfacial shearing stress in a thermoelectric module. in 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012., 6400633, 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012, pp. 9-12, 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012, Budapest, Hungary, 09/25/12.

Minimizing thermally induced interfacial shearing stress in a thermoelectric module. / Ziabari, Amirkoushyar; Suhir, Ephraim; Shakouri, Ali.
18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. 2012. p. 9-12 6400633 (18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Minimizing thermally induced interfacial shearing stress in a thermoelectric module

AU - Ziabari, Amirkoushyar

AU - Suhir, Ephraim

AU - Shakouri, Ali

PY - 2012

Y1 - 2012

N2 - The problem of minimizing the level of the thermally induced interfacial shearing stress in a Thermo-Electric Module (TEM) is addressed using analytical and finite-element-analysis (FEA) based modeling. The maximum stress is calculated for different leg sizes. Good agreement between the analytical and FEA predictions has been found. It is concluded that the shearing stress can be effectively minimized by using thinner legs with compliant interfaces.

AB - The problem of minimizing the level of the thermally induced interfacial shearing stress in a Thermo-Electric Module (TEM) is addressed using analytical and finite-element-analysis (FEA) based modeling. The maximum stress is calculated for different leg sizes. Good agreement between the analytical and FEA predictions has been found. It is concluded that the shearing stress can be effectively minimized by using thinner legs with compliant interfaces.

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M3 - Conference contribution

AN - SCOPUS:84872861539

SN - 9782355000225

T3 - 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012

SP - 9

EP - 12

BT - 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012

T2 - 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012

Y2 - 25 September 2012 through 27 September 2012

ER -

Minimizing thermally induced interfacial shearing stress in a thermoelectric module

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