Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes

Youngja Kim; Jinho Hah; Patxi Fernandez-Zelaia; Sangil Lee; Leroy Christie; Paul Houston; Shreyes Melkote; Kyoung Sik Moon; Ching Ping Wong

doi:10.1109/ECTC.2019.00324

Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes

Youngja Kim, Jinho Hah, Patxi Fernandez-Zelaia, Sangil Lee, Leroy Christie, Paul Houston, Shreyes Melkote, Kyoung Sik Moon, Ching Ping Wong

Deposition Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

Differences in microstructures of lead-free solder joints, Sn-Ag-Cu (96.5 wt./3.0 wt./0.5 wt.% SAC-305), made by two different semiconductor packaging processes such as reflow and TCB are discussed. Despite the enormous potential for TCB solder bonding process in microelectronic packaging, there has been few studies regarding the comparative analysis on electro-migration (EM) failure mechanism for the reflow process. We have systematically examined the EM-derived failures of the reflow and TCB-processed solder joints and demonstrated a process-structure-property linkage. This study also includes the analysis performed using generalized spherical harmonics (GSH) representation, a statistical and quantitative measure of material crystallographic informatics, which is novel in this field as to analyzing solder joint microstructures.

Original language	English
Title of host publication	Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	2349-2358
Number of pages	10
ISBN (Electronic)	9781728114989
DOIs	https://doi.org/10.1109/ECTC.2019.00324
State	Published - May 2019
Event	69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States Duration: May 28 2019 → May 31 2019

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2019-May
ISSN (Print)	0569-5503

Conference

Conference	69th IEEE Electronic Components and Technology Conference, ECTC 2019
Country/Territory	United States
City	Las Vegas
Period	05/28/19 → 05/31/19

Funding

The authors would like to thank Samsung Electronics for their support for this research.

Keywords

Electromigration (EM)
Intermetallic compound (IMC)
Pb-free solder
Reflow
Thermocompression bonding (TCB)

Access to Document

10.1109/ECTC.2019.00324

Cite this

Kim, Y., Hah, J., Fernandez-Zelaia, P., Lee, S., Christie, L., Houston, P., Melkote, S., Moon, K. S., & Wong, C. P. (2019). Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (pp. 2349-2358). Article 8811329 (Proceedings - Electronic Components and Technology Conference; Vol. 2019-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2019.00324

Kim, Youngja ; Hah, Jinho ; Fernandez-Zelaia, Patxi et al. / Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes. Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 2349-2358 (Proceedings - Electronic Components and Technology Conference).

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title = "Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes",

abstract = "Differences in microstructures of lead-free solder joints, Sn-Ag-Cu (96.5 wt./3.0 wt./0.5 wt.% SAC-305), made by two different semiconductor packaging processes such as reflow and TCB are discussed. Despite the enormous potential for TCB solder bonding process in microelectronic packaging, there has been few studies regarding the comparative analysis on electro-migration (EM) failure mechanism for the reflow process. We have systematically examined the EM-derived failures of the reflow and TCB-processed solder joints and demonstrated a process-structure-property linkage. This study also includes the analysis performed using generalized spherical harmonics (GSH) representation, a statistical and quantitative measure of material crystallographic informatics, which is novel in this field as to analyzing solder joint microstructures.",

keywords = "Electromigration (EM), Intermetallic compound (IMC), Pb-free solder, Reflow, Thermocompression bonding (TCB)",

author = "Youngja Kim and Jinho Hah and Patxi Fernandez-Zelaia and Sangil Lee and Leroy Christie and Paul Houston and Shreyes Melkote and Moon, {Kyoung Sik} and Wong, {Ching Ping}",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 69th IEEE Electronic Components and Technology Conference, ECTC 2019 ; Conference date: 28-05-2019 Through 31-05-2019",

year = "2019",

month = may,

doi = "10.1109/ECTC.2019.00324",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

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Kim, Y, Hah, J, Fernandez-Zelaia, P, Lee, S, Christie, L, Houston, P, Melkote, S, Moon, KS & Wong, CP 2019, Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes. in Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019., 8811329, Proceedings - Electronic Components and Technology Conference, vol. 2019-May, Institute of Electrical and Electronics Engineers Inc., pp. 2349-2358, 69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, United States, 05/28/19. https://doi.org/10.1109/ECTC.2019.00324

Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes. / Kim, Youngja; Hah, Jinho; Fernandez-Zelaia, Patxi et al.
Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 2349-2358 8811329 (Proceedings - Electronic Components and Technology Conference; Vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Kim, Youngja

AU - Hah, Jinho

AU - Fernandez-Zelaia, Patxi

AU - Lee, Sangil

AU - Christie, Leroy

AU - Houston, Paul

AU - Melkote, Shreyes

AU - Moon, Kyoung Sik

AU - Wong, Ching Ping

PY - 2019/5

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N2 - Differences in microstructures of lead-free solder joints, Sn-Ag-Cu (96.5 wt./3.0 wt./0.5 wt.% SAC-305), made by two different semiconductor packaging processes such as reflow and TCB are discussed. Despite the enormous potential for TCB solder bonding process in microelectronic packaging, there has been few studies regarding the comparative analysis on electro-migration (EM) failure mechanism for the reflow process. We have systematically examined the EM-derived failures of the reflow and TCB-processed solder joints and demonstrated a process-structure-property linkage. This study also includes the analysis performed using generalized spherical harmonics (GSH) representation, a statistical and quantitative measure of material crystallographic informatics, which is novel in this field as to analyzing solder joint microstructures.

AB - Differences in microstructures of lead-free solder joints, Sn-Ag-Cu (96.5 wt./3.0 wt./0.5 wt.% SAC-305), made by two different semiconductor packaging processes such as reflow and TCB are discussed. Despite the enormous potential for TCB solder bonding process in microelectronic packaging, there has been few studies regarding the comparative analysis on electro-migration (EM) failure mechanism for the reflow process. We have systematically examined the EM-derived failures of the reflow and TCB-processed solder joints and demonstrated a process-structure-property linkage. This study also includes the analysis performed using generalized spherical harmonics (GSH) representation, a statistical and quantitative measure of material crystallographic informatics, which is novel in this field as to analyzing solder joint microstructures.

KW - Electromigration (EM)

KW - Intermetallic compound (IMC)

KW - Pb-free solder

KW - Reflow

KW - Thermocompression bonding (TCB)

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PB - Institute of Electrical and Electronics Engineers Inc.

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ER -

Kim Y, Hah J, Fernandez-Zelaia P, Lee S, Christie L, Houston P et al. Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 2349-2358. 8811329. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2019.00324

Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes

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