Microstructure of tungsten copper and model to predict thermal conductivity

John L. Johnson; Seong Lee; Joon Woong Noh; Young Sam Kwon; Seong Jin Park; Reza Yassar; Randall M. German; Hsin Wang; Ralph B. Dinwiddie

Microstructure of tungsten copper and model to predict thermal conductivity

John L. Johnson, Seong Lee, Joon Woong Noh, Young Sam Kwon, Seong Jin Park, Reza Yassar, Randall M. German, Hsin Wang, Ralph B. Dinwiddie

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, TC, CTE, and microstructure are measured for sintered compacts from nano tungsten coated copper powder. A finite element model is developed to investigate the effects of solid volume fraction, grain size, contiguity, porosity, and impurities on thermal conductivity. The predictions are compared to the experimentally measured values. Processing routes for optimal microstructures are identified.

Original language	English
Title of host publication	Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007
Pages	999-9110
Number of pages	8112
State	Published - 2007
Externally published	Yes
Event	2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007 - Denver, CO, United States Duration: May 13 2007 → May 16 2007

Publication series

Name	Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007

Conference

Conference	2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007
Country/Territory	United States
City	Denver, CO
Period	05/13/07 → 05/16/07

Cite this

Johnson, J. L., Lee, S., Noh, J. W., Kwon, Y. S., Park, S. J., Yassar, R., German, R. M., Wang, H., & Dinwiddie, R. B. (2007). Microstructure of tungsten copper and model to predict thermal conductivity. In Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007 (pp. 999-9110). (Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007).

Johnson, John L. ; Lee, Seong ; Noh, Joon Woong et al. / Microstructure of tungsten copper and model to predict thermal conductivity. Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007. 2007. pp. 999-9110 (Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007).

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title = "Microstructure of tungsten copper and model to predict thermal conductivity",

abstract = "Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, TC, CTE, and microstructure are measured for sintered compacts from nano tungsten coated copper powder. A finite element model is developed to investigate the effects of solid volume fraction, grain size, contiguity, porosity, and impurities on thermal conductivity. The predictions are compared to the experimentally measured values. Processing routes for optimal microstructures are identified.",

author = "Johnson, {John L.} and Seong Lee and Noh, {Joon Woong} and Kwon, {Young Sam} and Park, {Seong Jin} and Reza Yassar and German, {Randall M.} and Hsin Wang and Dinwiddie, {Ralph B.}",

year = "2007",

language = "English",

isbn = "0979348854",

series = "Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007",

pages = "999--9110",

booktitle = "Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007",

note = "2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007 ; Conference date: 13-05-2007 Through 16-05-2007",

}

Johnson, JL, Lee, S, Noh, JW, Kwon, YS, Park, SJ, Yassar, R, German, RM, Wang, H & Dinwiddie, RB 2007, Microstructure of tungsten copper and model to predict thermal conductivity. in Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007. Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007, pp. 999-9110, 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007, Denver, CO, United States, 05/13/07.

Microstructure of tungsten copper and model to predict thermal conductivity. / Johnson, John L.; Lee, Seong; Noh, Joon Woong et al.
Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007. 2007. p. 999-9110 (Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Microstructure of tungsten copper and model to predict thermal conductivity

AU - Johnson, John L.

AU - Lee, Seong

AU - Noh, Joon Woong

AU - Kwon, Young Sam

AU - Park, Seong Jin

AU - Yassar, Reza

AU - German, Randall M.

AU - Wang, Hsin

AU - Dinwiddie, Ralph B.

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AB - Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, TC, CTE, and microstructure are measured for sintered compacts from nano tungsten coated copper powder. A finite element model is developed to investigate the effects of solid volume fraction, grain size, contiguity, porosity, and impurities on thermal conductivity. The predictions are compared to the experimentally measured values. Processing routes for optimal microstructures are identified.

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M3 - Conference contribution

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T3 - Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007

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BT - Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007

T2 - 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007

Y2 - 13 May 2007 through 16 May 2007

ER -

Johnson JL, Lee S, Noh JW, Kwon YS, Park SJ, Yassar R et al. Microstructure of tungsten copper and model to predict thermal conductivity. In Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007. 2007. p. 999-9110. (Advances in Powder Metallurgy and Particulate Materials - 2007, Proceedings of the 2007 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2007).

Microstructure of tungsten copper and model to predict thermal conductivity

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