Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity

Hwangsun Kim, Jee Hyuk Ahn, Seung Zeon Han, Janghyun Jo, Hionsuck Baik, Miyoung Kim, Heung Nam Han

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Abstract

A Cu alloy with high strength and conductivity, which are trade off characteristics, was developed using discontinuous precipitates as the hardening agent. The scanning electron microscopy and transmission electron microscopy results showed that a considerable internal strain and geometrically necessary dislocations were generated in the alloy because of discontinuous precipitation. Furthermore, nanotwins, which are rarely observed in cold-drawn Cu–Ni–Si alloys, were observed in the alloy. Since nanotwins show little effect on the electrical resistivity of Cu alloys while effectively interfering with the dislocation movement, they are one of the key factors endowing Cu alloys with the trade-off characteristics of high strength and conductivity.

Original languageEnglish
Article number155059
JournalJournal of Alloys and Compounds
Volume832
DOIs
StatePublished - Aug 15 2020
Externally publishedYes

Funding

This work was supported by the National Research Foundation of Korea (NRF) grants funded by the Ministry of Science and ICT (MSIT) [No. 2020R1A5A6017701 and No. 2018R1A2B6006856 ]. The Institute of Engineering Research at Seoul National University provided research facilities for this work. This work was supported by the National Research Foundation of Korea (NRF) grants funded by the Ministry of Science and ICT (MSIT) [No. 2020R1A5A6017701 and No. 2018R1A2B6006856]. The Institute of Engineering Research at Seoul National University provided research facilities for this work.

Keywords

  • Cu alloy
  • Intermetallics
  • Microstructure
  • Nanostructured materials
  • Transmission electron microscopy

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