Microscale molding replication of Cu- and Ni-based structures

J. Jiang; Fanghua Mei; W. J. Meng; E. Lara-Curzio

doi:10.1007/s00542-007-0516-9

Microscale molding replication of Cu- and Ni-based structures

J. Jiang
, Fanghua Mei
, W. J. Meng
, E. Lara-Curzio

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cost-effective fabrication of metal-based HARMS is paramount to the economic viability of such devices and systems. Microscale molding replication promises low-cost, high-throughput production of metal-based HARMS. In this paper, results on molding replication of Cu- and Ni-based HARMS are reported. Molding response of Cu was measured as a function of temperature. Attempts were made to rationalize measured molding responses with companion high-temperature tensile testing. Fabrication of Ni-based HARMS by compression molding is demonstrated successfully for the first time.

Original language	English
Pages (from-to)	1731-1737
Number of pages	7
Journal	Microsystem Technologies
Volume	14
Issue number	9-11
DOIs	https://doi.org/10.1007/s00542-007-0516-9
State	Published - Oct 2008

Funding

We gratefully acknowledge partial project support from NSF through grants DMI-0400061/DMI-0556100, and from the Louisiana Board of Regents (LA BoR) through contract LEQSF (2004-07)-RD-B-06.

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title = "Microscale molding replication of Cu- and Ni-based structures",

abstract = "Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cost-effective fabrication of metal-based HARMS is paramount to the economic viability of such devices and systems. Microscale molding replication promises low-cost, high-throughput production of metal-based HARMS. In this paper, results on molding replication of Cu- and Ni-based HARMS are reported. Molding response of Cu was measured as a function of temperature. Attempts were made to rationalize measured molding responses with companion high-temperature tensile testing. Fabrication of Ni-based HARMS by compression molding is demonstrated successfully for the first time.",

author = "J. Jiang and Fanghua Mei and Meng, \{W. J.\} and E. Lara-Curzio",

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AU - Mei, Fanghua

AU - Meng, W. J.

AU - Lara-Curzio, E.

PY - 2008/10

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N2 - Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cost-effective fabrication of metal-based HARMS is paramount to the economic viability of such devices and systems. Microscale molding replication promises low-cost, high-throughput production of metal-based HARMS. In this paper, results on molding replication of Cu- and Ni-based HARMS are reported. Molding response of Cu was measured as a function of temperature. Attempts were made to rationalize measured molding responses with companion high-temperature tensile testing. Fabrication of Ni-based HARMS by compression molding is demonstrated successfully for the first time.

AB - Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cost-effective fabrication of metal-based HARMS is paramount to the economic viability of such devices and systems. Microscale molding replication promises low-cost, high-throughput production of metal-based HARMS. In this paper, results on molding replication of Cu- and Ni-based HARMS are reported. Molding response of Cu was measured as a function of temperature. Attempts were made to rationalize measured molding responses with companion high-temperature tensile testing. Fabrication of Ni-based HARMS by compression molding is demonstrated successfully for the first time.

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M3 - Article

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VL - 14

SP - 1731

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JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 9-11

ER -

Microscale molding replication of Cu- and Ni-based structures

Abstract

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