Abstract
Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cost-effective fabrication of metal-based HARMS is paramount to the economic viability of such devices and systems. Microscale molding replication promises low-cost, high-throughput production of metal-based HARMS. In this paper, results on molding replication of Cu- and Ni-based HARMS are reported. Molding response of Cu was measured as a function of temperature. Attempts were made to rationalize measured molding responses with companion high-temperature tensile testing. Fabrication of Ni-based HARMS by compression molding is demonstrated successfully for the first time.
Original language | English |
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Pages (from-to) | 1731-1737 |
Number of pages | 7 |
Journal | Microsystem Technologies |
Volume | 14 |
Issue number | 9-11 |
DOIs | |
State | Published - Oct 2008 |
Externally published | Yes |
Funding
We gratefully acknowledge partial project support from NSF through grants DMI-0400061/DMI-0556100, and from the Louisiana Board of Regents (LA BoR) through contract LEQSF (2004-07)-RD-B-06.
Funders | Funder number |
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National Science Foundation | DMI-0400061/DMI-0556100 |
Louisiana Board of Regents | LEQSF (2004-07)-RD-B-06 |