Microscale molding replication of Cu- and Ni-based structures

J. Jiang, Fanghua Mei, W. J. Meng, E. Lara-Curzio

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cost-effective fabrication of metal-based HARMS is paramount to the economic viability of such devices and systems. Microscale molding replication promises low-cost, high-throughput production of metal-based HARMS. In this paper, results on molding replication of Cu- and Ni-based HARMS are reported. Molding response of Cu was measured as a function of temperature. Attempts were made to rationalize measured molding responses with companion high-temperature tensile testing. Fabrication of Ni-based HARMS by compression molding is demonstrated successfully for the first time.

Original languageEnglish
Pages (from-to)1731-1737
Number of pages7
JournalMicrosystem Technologies
Volume14
Issue number9-11
DOIs
StatePublished - Oct 2008
Externally publishedYes

Funding

We gratefully acknowledge partial project support from NSF through grants DMI-0400061/DMI-0556100, and from the Louisiana Board of Regents (LA BoR) through contract LEQSF (2004-07)-RD-B-06.

FundersFunder number
National Science FoundationDMI-0400061/DMI-0556100
Louisiana Board of RegentsLEQSF (2004-07)-RD-B-06

    Fingerprint

    Dive into the research topics of 'Microscale molding replication of Cu- and Ni-based structures'. Together they form a unique fingerprint.

    Cite this