Mechanical behavior of high-entropy alloys: A review

Yuanyuan Shang, Jamieson Brechtl, Claudio Pistidda, Peter K. Liaw

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

24 Scopus citations

Abstract

High-entropy alloys (HEAs) are materials that consist of equimolar or near-equimolar multiple principal components but tend to form single phases, which is a new research topic in the field of metallurgy, and have attracted extensive attention in the past decade. The HEAs families contain the face-centered-cubic (fcc), body-centered-cubic (bcc), and hexagonal-close-packed (hcp)-structured HEAs. On the one hand, mechanical properties, e.g., hardness, strength, ductility, fatigue, and elastic moduli, are essential for practical applications of HEAs. Scientists have explored in this direction since the advent of HEAs. On the other hand, the pursuit of high strength and good plasticity is the critical research issue of materials. Hence, strengthening of HEAs is a crucial issue. In this chapter, we reviewed the recent work on the room-temperature elastic properties and mechanical behavior of HEAs, including the mechanisms behind the plastic deformation of HEAs at both low and high temperatures. Furthermore, the present work examined the strengthening strategies of HEAs, e.g., strain hardening, grain-boundary strengthening, solid-solution strengthening, and particle strengthening. The fatigue, creep, and fracture properties were briefly introduced. Lastly, the future scientific issues and challenges of HEAs were discussed.

Original languageEnglish
Title of host publicationHigh-Entropy Materials
Subtitle of host publicationTheory, Experiments, and Applications
PublisherSpringer International Publishing
Pages435-522
Number of pages88
ISBN (Electronic)9783030776411
ISBN (Print)9783030776404
DOIs
StatePublished - Jan 3 2022

Keywords

  • Alloy design
  • Deformation twins
  • Dislocations
  • Elastic properties
  • Grain-boundary strengthening
  • High-entropy alloys
  • Mechanical properties
  • Microstructure
  • Modeling
  • Multicomponent
  • Particle strengthening
  • Phase stability
  • Simulation calculations
  • Solid-solution phase
  • Solid-solution strengthening
  • Stacking faults
  • Strain hardening
  • Strengthening
  • TRIP effects
  • TWIP effects

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