Maximizing the performance of a 3D printed heat sink by accounting for anisotropic thermal conductivity during filament deposition

Matthew Smith, Seokpum Kim, Alexander Lambert, Maxwell Walde, John Lindahl, Kaustubh Mungale, Thomas Bougher, Ahmed Arabi Hassen, Vlastimil Kunc

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

23 Scopus citations

Abstract

Newly developed high thermal conductivity polymer composite 3D printing filaments are used to characterize the thermal properties as a function of print orientation. The thermal conductivity of a printed part is anisotropic and varies by 2 - 6 times depending on the print direction - demonstrating higher conductivity in the deposition direction (in-plane) than in the two directions perpendicular to the deposition direction (cross-plane and through-plane). Therefore, deposition path planning greatly affects the overall heat dissipation rate and the performance of the heat sink. Traditionally, 3D printing slicers generate deposition paths based solely on geometric constraints. This work investigates a new approach of deposition path planning assisted by computational predictions of the heat sink thermal performance. The proposed approach uses a thermal simulation of a 3D-printed part, accounting for the anisotropic thermal properties, and the orientation of the local material properties are assigned based on the deposition path in multiple print orientations. The performances predicted via the simulations are compared, and the optimal deposition path is determined. For the highest thermal conductivity 3D printing filament (~12 W/m-K in-plane), a heat sink printed with the print direction parallel to the fins z-axis had ~20% improved performance in comparison to a heat sink with print direction perpendicular to the fins z-axis. Moreover, a plastic 3D printed heat sink was able to perform within 7% of an extruded Aluminum heat sink with similar geometry under natural convection. The computational predictions show the same trend as experimental measurements using 3D printed heat sinks.

Original languageEnglish
Title of host publicationProceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
PublisherIEEE Computer Society
Pages626-632
Number of pages7
ISBN (Electronic)9781728124612
DOIs
StatePublished - May 2019
Event18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 - Las Vegas, United States
Duration: May 28 2019May 31 2019

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2019-May
ISSN (Print)1936-3958

Conference

Conference18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
Country/TerritoryUnited States
CityLas Vegas
Period05/28/1905/31/19

Funding

This research is sponsored by the U.S. Department of Energy, Office of Energy Efficiency and Renewable Energy, Industrial Technologies Program, under contract DE-AC05-00OR22725 with UT-Battelle, LLC. This manuscript has been authored by UT-Battelle, LLC, under contract DE-AC05-00OR22725 with the US Department of Energy (DOE). The US government retains and the publisher, by accepting the article for publication, acknowledges that the US government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this manuscript, or allow others to do so, for US government purposes. DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (http://energy.gov/downloads/doe-public-access-plan).

FundersFunder number
U.S. Department of Energy
Office of Energy Efficiency and Renewable EnergyDE-AC05-00OR22725

    Keywords

    • 3D printing
    • Computational Prediction
    • Fused Filament Fabrication (FFF)
    • Heat sink
    • Thermally conductive filament

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