TY - GEN
T1 - Maximizing the performance of a 3D printed heat sink by accounting for anisotropic thermal conductivity during filament deposition
AU - Smith, Matthew
AU - Kim, Seokpum
AU - Lambert, Alexander
AU - Walde, Maxwell
AU - Lindahl, John
AU - Mungale, Kaustubh
AU - Bougher, Thomas
AU - Hassen, Ahmed Arabi
AU - Kunc, Vlastimil
N1 - Publisher Copyright:
© 2019 IEEE
PY - 2019/5
Y1 - 2019/5
N2 - Newly developed high thermal conductivity polymer composite 3D printing filaments are used to characterize the thermal properties as a function of print orientation. The thermal conductivity of a printed part is anisotropic and varies by 2 - 6 times depending on the print direction - demonstrating higher conductivity in the deposition direction (in-plane) than in the two directions perpendicular to the deposition direction (cross-plane and through-plane). Therefore, deposition path planning greatly affects the overall heat dissipation rate and the performance of the heat sink. Traditionally, 3D printing slicers generate deposition paths based solely on geometric constraints. This work investigates a new approach of deposition path planning assisted by computational predictions of the heat sink thermal performance. The proposed approach uses a thermal simulation of a 3D-printed part, accounting for the anisotropic thermal properties, and the orientation of the local material properties are assigned based on the deposition path in multiple print orientations. The performances predicted via the simulations are compared, and the optimal deposition path is determined. For the highest thermal conductivity 3D printing filament (~12 W/m-K in-plane), a heat sink printed with the print direction parallel to the fins z-axis had ~20% improved performance in comparison to a heat sink with print direction perpendicular to the fins z-axis. Moreover, a plastic 3D printed heat sink was able to perform within 7% of an extruded Aluminum heat sink with similar geometry under natural convection. The computational predictions show the same trend as experimental measurements using 3D printed heat sinks.
AB - Newly developed high thermal conductivity polymer composite 3D printing filaments are used to characterize the thermal properties as a function of print orientation. The thermal conductivity of a printed part is anisotropic and varies by 2 - 6 times depending on the print direction - demonstrating higher conductivity in the deposition direction (in-plane) than in the two directions perpendicular to the deposition direction (cross-plane and through-plane). Therefore, deposition path planning greatly affects the overall heat dissipation rate and the performance of the heat sink. Traditionally, 3D printing slicers generate deposition paths based solely on geometric constraints. This work investigates a new approach of deposition path planning assisted by computational predictions of the heat sink thermal performance. The proposed approach uses a thermal simulation of a 3D-printed part, accounting for the anisotropic thermal properties, and the orientation of the local material properties are assigned based on the deposition path in multiple print orientations. The performances predicted via the simulations are compared, and the optimal deposition path is determined. For the highest thermal conductivity 3D printing filament (~12 W/m-K in-plane), a heat sink printed with the print direction parallel to the fins z-axis had ~20% improved performance in comparison to a heat sink with print direction perpendicular to the fins z-axis. Moreover, a plastic 3D printed heat sink was able to perform within 7% of an extruded Aluminum heat sink with similar geometry under natural convection. The computational predictions show the same trend as experimental measurements using 3D printed heat sinks.
KW - 3D printing
KW - Computational Prediction
KW - Fused Filament Fabrication (FFF)
KW - Heat sink
KW - Thermally conductive filament
UR - http://www.scopus.com/inward/record.url?scp=85073897198&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2019.8757285
DO - 10.1109/ITHERM.2019.8757285
M3 - Conference contribution
AN - SCOPUS:85073897198
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 626
EP - 632
BT - Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
PB - IEEE Computer Society
T2 - 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
Y2 - 28 May 2019 through 31 May 2019
ER -