Abstract
We exploit interfacial charge transfer from titania (TiO2) to copper (Cu) to design catalytic Cu/TiO2 composite aerogels that shift the chemical state of Cu nanoparticles away from Cu2+, making them highly active for low-temperature CO oxidation. The high degree of interfacial contact between ∼2–3 nm–diameter Cu particles and the networked ∼10 nm–diameter TiO2 particles in ultraporous aerogel stabilizes a high ratio of Cu0/1+:Cu2+. The reduced nature of Cu in Cu/TiO2 aerogels is evidenced by a strong surface plasmon resonance in its diffuse reflectance UV–vis spectrum, by its X-ray photoelectron spectral features, and by infrared spectroscopic evidence of CO binding at the catalyst surface. In contrast, when larger diameter (∼50–60 nm), non–networked TiO2 particles are used to support Cu nanoparticles, the single planar nanoscale interface between Cu and the support particle stabilizes a much lower fraction of low-valent Cu. The Cu0/1+ speciation stabilized within the aerogel catalyzes low-temperature CO oxidation (<100 °C) at high conversion rates and does not necessitate high-temperature activation in a reducing gas stream—performance that the non-networked catalyst cannot meet. Our work demonstrates how nanoscale interfacial materials design can be exploited to create active Cu nanoparticle–based catalysts that are stable under practical conditions.
Original language | English |
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Pages (from-to) | 205-213 |
Number of pages | 9 |
Journal | Applied Catalysis B: Environmental |
Volume | 252 |
DOIs | |
State | Published - Sep 5 2019 |
Externally published | Yes |
Funding
The authors acknowledge the Defense Threat Reduction Agency for support of this work. C.L.P. and A.M.P gratefully acknowledge the U.S. National Research Council for support through a Naval Research Laboratory/National Research Council Postdoctoral Associateship.
Funders | Funder number |
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Naval Research Laboratory/National Research Council | |
Defense Threat Reduction Agency | |
National Research Council |
Keywords
- Aerogels
- CO oxidation
- Copper nanoparticles
- Reducing oxide supports