TY - GEN
T1 - Low-noise readout channel with a novel dynamic signal compression for future X-FEL applications
AU - Comotti, D.
AU - Fabris, L.
AU - Grassi, M.
AU - Lodola, L.
AU - Malcovati, P.
AU - Manghisoni, M.
AU - Ratti, L.
AU - Re, V.
AU - Traversi, G.
AU - Vacchi, C.
AU - Batignani, G.
AU - Bettarini, S.
AU - Casarosa, G.
AU - Forti, F.
AU - Morsani, F.
AU - Paladino, A.
AU - Paoloni, E.
AU - Rizzo, G.
AU - Benckechkache, M. A.
AU - Dalla Betta, G. F.
AU - Mendicino, R.
AU - Pancheri, L.
AU - Verzellesi, G.
AU - Xu, H.
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2016/3/10
Y1 - 2016/3/10
N2 - This work presents the design of a read-out channel suitable for application to silicon pixel detectors for the next generation Free Electron Laser (FEL) experiments. The readout architecture, which has been carried out in a 65 nm CMOS technology, consists of a low-noise charge sensitive amplifier (CSA) with dynamic signal compression, a time-variant shaping stage and a low-power analog-to-digital converter (ADC), hosted in a 100 μm-pitch pixel. The blocks will be operated in such a way to cope with the high frame rates (exceeding 1 MHz) foreseen for future X-ray FEL machines. The paper describes in detail the architecture and the performance of the CSA and provides an overview about the analog readout channel.
AB - This work presents the design of a read-out channel suitable for application to silicon pixel detectors for the next generation Free Electron Laser (FEL) experiments. The readout architecture, which has been carried out in a 65 nm CMOS technology, consists of a low-noise charge sensitive amplifier (CSA) with dynamic signal compression, a time-variant shaping stage and a low-power analog-to-digital converter (ADC), hosted in a 100 μm-pitch pixel. The blocks will be operated in such a way to cope with the high frame rates (exceeding 1 MHz) foreseen for future X-ray FEL machines. The paper describes in detail the architecture and the performance of the CSA and provides an overview about the analog readout channel.
UR - http://www.scopus.com/inward/record.url?scp=84965025636&partnerID=8YFLogxK
U2 - 10.1109/NSSMIC.2014.7431119
DO - 10.1109/NSSMIC.2014.7431119
M3 - Conference contribution
AN - SCOPUS:84965025636
T3 - 2014 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2014
BT - 2014 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2014
Y2 - 8 November 2014 through 15 November 2014
ER -