Abstract
Thermoelectric (TE) modules used in a heat pumping mode are increasingly being used for various applications involving heating and cooling. As their use becomes more prevalent and extends to lower cost applications using inexpensive commodity power supplies, it is important to characterize the long-term effects of power cycling and power quality on their performance. Two power supplies were evaluated with different levels of periodic and random deviations (PARD) from ideal DC power. This paper presents the results of an accelerated aging experimental study on intermittent power cycling of TE modules over the span of 5 actual months with each power supply. TE performance metrics that were monitored at specific time intervals are the AC resistance and figure of merit. The applied voltage, power consumption, TE hot and cold side temperatures and air temperatures were continuously measured. The experimental results indicate that the low-quality power supply quality had only a minor influence on properties and integrity of the TE modules, and is suitable for applications requiring intermittent use without a substantial reduction in performance.
| Original language | English |
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| Title of host publication | ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 |
| Publisher | American Society of Mechanical Engineers (ASME) |
| ISBN (Electronic) | 9780791851920 |
| DOIs | |
| State | Published - 2018 |
| Event | ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 - San Francisco, United States Duration: Aug 27 2018 → Aug 30 2018 |
Publication series
| Name | ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 |
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Conference
| Conference | ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 |
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| Country/Territory | United States |
| City | San Francisco |
| Period | 08/27/18 → 08/30/18 |
Funding
*This manuscript has been authored by UT-Battelle, LLC under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy. The United States Government retains and the publisher, by accepting the article for publication, acknowledges that the United States Government retains a non-exclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form This work was sponsored by the U. S. Department of Energy’s Building Technologies Office under Contract No. DE-AC05-00OR22725 with UT-Battelle, LLC. The authors would also like to acknowledge Mr. Antonio Bouza, Technology Manager – HVAC&R, Water Heating, and Appliance, U.S. Department of Energy Building Technologies Office.