Liquid-cooled heat sink optimization for thermal imbalance mitigation in wide-bandgap power modules

Raj Sahu; Emre Gurpinar; Burak Ozpineci

doi:10.1115/IPACK2020-2516

Liquid-cooled heat sink optimization for thermal imbalance mitigation in wide-bandgap power modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci

Buildings and Transportation Science Div

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

Power semiconductor die layout in substrates used in power modules is generally optimized for minimum electrical parasitics (e.g., stray inductance) by considering the minimum spacing between dies for thermal decoupling. The layout assumes sufficient heat spreading and transfer from dies to the cooling structure. For module designs using a direct substrate cooling method, the base plate is removed, leading to a steady-state thermal asymmetry in the power module due to insufficient heat spreading/transfer. This causes significant temperature differences among the devices. Such unintentional thermal asymmetries can lead to undesirable asymmetries in power conversion among semiconductor devices, which impact reliability. This article proposes a thermal imbalance mitigation method that uses evolutionary optimized liquid-cooled heat sinks to improve the thermal loading among devices.

Original language	English
Title of host publication	ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
Publisher	American Society of Mechanical Engineers
ISBN (Electronic)	9780791884041
DOIs	https://doi.org/10.1115/IPACK2020-2516
State	Published - 2020
Event	ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020 - Virtual, Online Duration: Oct 27 2020 → Oct 29 2020

Publication series

Name	ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020

Conference

Conference	ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
City	Virtual, Online
Period	10/27/20 → 10/29/20

Funding

This manuscript has been authored by UT-Battelle LLC under Contract DE-AC05-00OR22725 with the US Department of Energy (DOE). The US government retains and the publisher, by accepting the article for publication, acknowledges that the US government retains a nonexclusive, paid-up,irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for US government purposes. DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (http://energy.gov/downloads/doe-public-access-plan). This material is based upon work supported by the US Department of Energy, Vehicle Technologies Office, Electric Drive Technologies Program. The authors thank Susan Rogers of the Department of Energy for managerial support.

Funders	Funder number
US Department of Energy
U.S. Department of Energy
UT-Battelle	DE-AC05-00OR22725

Access to Document

10.1115/IPACK2020-2516

Cite this

Sahu, R., Gurpinar, E., & Ozpineci, B. (2020). Liquid-cooled heat sink optimization for thermal imbalance mitigation in wide-bandgap power modules. In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020 Article V001T07A001 (ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020). American Society of Mechanical Engineers. https://doi.org/10.1115/IPACK2020-2516

Sahu, Raj ; Gurpinar, Emre ; Ozpineci, Burak. / Liquid-cooled heat sink optimization for thermal imbalance mitigation in wide-bandgap power modules. ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020. American Society of Mechanical Engineers, 2020. (ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020).

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abstract = "Power semiconductor die layout in substrates used in power modules is generally optimized for minimum electrical parasitics (e.g., stray inductance) by considering the minimum spacing between dies for thermal decoupling. The layout assumes sufficient heat spreading and transfer from dies to the cooling structure. For module designs using a direct substrate cooling method, the base plate is removed, leading to a steady-state thermal asymmetry in the power module due to insufficient heat spreading/transfer. This causes significant temperature differences among the devices. Such unintentional thermal asymmetries can lead to undesirable asymmetries in power conversion among semiconductor devices, which impact reliability. This article proposes a thermal imbalance mitigation method that uses evolutionary optimized liquid-cooled heat sinks to improve the thermal loading among devices.",

author = "Raj Sahu and Emre Gurpinar and Burak Ozpineci",

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doi = "10.1115/IPACK2020-2516",

language = "English",

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Sahu, R, Gurpinar, E & Ozpineci, B 2020, Liquid-cooled heat sink optimization for thermal imbalance mitigation in wide-bandgap power modules. in ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020., V001T07A001, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, American Society of Mechanical Engineers, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, Virtual, Online, 10/27/20. https://doi.org/10.1115/IPACK2020-2516

Liquid-cooled heat sink optimization for thermal imbalance mitigation in wide-bandgap power modules. / Sahu, Raj; Gurpinar, Emre; Ozpineci, Burak.
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020. American Society of Mechanical Engineers, 2020. V001T07A001 (ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - Power semiconductor die layout in substrates used in power modules is generally optimized for minimum electrical parasitics (e.g., stray inductance) by considering the minimum spacing between dies for thermal decoupling. The layout assumes sufficient heat spreading and transfer from dies to the cooling structure. For module designs using a direct substrate cooling method, the base plate is removed, leading to a steady-state thermal asymmetry in the power module due to insufficient heat spreading/transfer. This causes significant temperature differences among the devices. Such unintentional thermal asymmetries can lead to undesirable asymmetries in power conversion among semiconductor devices, which impact reliability. This article proposes a thermal imbalance mitigation method that uses evolutionary optimized liquid-cooled heat sinks to improve the thermal loading among devices.

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M3 - Conference contribution

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BT - ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020

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Sahu R, Gurpinar E, Ozpineci B. Liquid-cooled heat sink optimization for thermal imbalance mitigation in wide-bandgap power modules. In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020. American Society of Mechanical Engineers. 2020. V001T07A001. (ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020). doi: 10.1115/IPACK2020-2516

Liquid-cooled heat sink optimization for thermal imbalance mitigation in wide-bandgap power modules

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