Lightweight Metal Stamping Optimization Enabled by Artificial Intelligence

Pum Kim; William Halsey; Deepak Pokkalla; Rich Davies; Vincent Paquit; Krishna Murali; Sathya Dev; Liang Huang; Kaiping Li; Andrey Ilinich; Weidong Wu; Lu Huang; Thomas Stoughton; Kidambi Kannan

doi:10.2172/3007923

Lightweight Metal Stamping Optimization Enabled by Artificial Intelligence

Pum Kim
, William Halsey
, Deepak Pokkalla
, Rich Davies
, Vincent Paquit
, Krishna Murali
, Sathya Dev
, Liang Huang
, Kaiping Li
, Andrey Ilinich
, Weidong Wu
, Lu Huang
, Thomas Stoughton
, Kidambi Kannan

Research output: Other contribution › Technical Report

Original language	English
Place of Publication	United States
DOIs	https://doi.org/10.2172/3007923
State	Published - 2025

Access to Document

10.2172/3007923

Cite this

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title = "Lightweight Metal Stamping Optimization Enabled by Artificial Intelligence",

author = "Pum Kim and William Halsey and Deepak Pokkalla and Rich Davies and Vincent Paquit and Krishna Murali and Sathya Dev and Liang Huang and Kaiping Li and Andrey Ilinich and Weidong Wu and Lu Huang and Thomas Stoughton and Kidambi Kannan",

year = "2025",

doi = "10.2172/3007923",

language = "English",

type = "Other",

}

TY - GEN

T1 - Lightweight Metal Stamping Optimization Enabled by Artificial Intelligence

AU - Kim, Pum

AU - Halsey, William

AU - Pokkalla, Deepak

AU - Davies, Rich

AU - Paquit, Vincent

AU - Murali, Krishna

AU - Dev, Sathya

AU - Huang, Liang

AU - Li, Kaiping

AU - Ilinich, Andrey

AU - Wu, Weidong

AU - Huang, Lu

AU - Stoughton, Thomas

AU - Kannan, Kidambi

PY - 2025

Y1 - 2025

U2 - 10.2172/3007923

DO - 10.2172/3007923

M3 - Technical Report

CY - United States

ER -