Investigations of the Weibull modulus as a function of stressing rate

M. J. Andrews; A. A. Wereszczak; K. Breder; M. K. Ferber; T. P. Kirkland

Investigations of the Weibull modulus as a function of stressing rate

M. J. Andrews, A. A. Wereszczak, K. Breder, M. K. Ferber, T. P. Kirkland

Mechanical Properties and Mechanics

Research output: Contribution to journal › Conference article › peer-review

3 Scopus citations

Abstract

Experimental data for commercialized Si₃N₄ shows that surface flaws are more susceptible to slow crack growth (SCG) than volume flaws. Within a 95 percent confidence band, the Weibull modulus is significantly decreased for surface-induced failures as the stressing rate decreased. The volume-induced failures, which are less susceptible to SCG, shows no significant decrease in the Weibull modulus. As the stressing rate decreases, surface failures have greater influence in decreasing the Weibull modulus than volume failures.

Original language	English
Pages (from-to)	79-87
Number of pages	9
Journal	Ceramic Engineering and Science Proceedings
Volume	19
Issue number	4
State	Published - 1998
Event	Proceedings of the 1998 22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A. Part 1 (of 2) - Cocoa Beach, FL, USA Duration: Jan 20 1998 → Jan 24 1998

Cite this

@article{2249a1dff967447b9163858a1cd382c5,

title = "Investigations of the Weibull modulus as a function of stressing rate",

abstract = "Experimental data for commercialized Si3N4 shows that surface flaws are more susceptible to slow crack growth (SCG) than volume flaws. Within a 95 percent confidence band, the Weibull modulus is significantly decreased for surface-induced failures as the stressing rate decreased. The volume-induced failures, which are less susceptible to SCG, shows no significant decrease in the Weibull modulus. As the stressing rate decreases, surface failures have greater influence in decreasing the Weibull modulus than volume failures.",

author = "Andrews, {M. J.} and Wereszczak, {A. A.} and K. Breder and Ferber, {M. K.} and Kirkland, {T. P.}",

year = "1998",

language = "English",

volume = "19",

pages = "79--87",

journal = "Ceramic Engineering and Science Proceedings",

issn = "0196-6219",

number = "4",

note = "Proceedings of the 1998 22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A. Part 1 (of 2) ; Conference date: 20-01-1998 Through 24-01-1998",

}

TY - JOUR

T1 - Investigations of the Weibull modulus as a function of stressing rate

AU - Andrews, M. J.

AU - Wereszczak, A. A.

AU - Breder, K.

AU - Ferber, M. K.

AU - Kirkland, T. P.

PY - 1998

Y1 - 1998

N2 - Experimental data for commercialized Si3N4 shows that surface flaws are more susceptible to slow crack growth (SCG) than volume flaws. Within a 95 percent confidence band, the Weibull modulus is significantly decreased for surface-induced failures as the stressing rate decreased. The volume-induced failures, which are less susceptible to SCG, shows no significant decrease in the Weibull modulus. As the stressing rate decreases, surface failures have greater influence in decreasing the Weibull modulus than volume failures.

AB - Experimental data for commercialized Si3N4 shows that surface flaws are more susceptible to slow crack growth (SCG) than volume flaws. Within a 95 percent confidence band, the Weibull modulus is significantly decreased for surface-induced failures as the stressing rate decreased. The volume-induced failures, which are less susceptible to SCG, shows no significant decrease in the Weibull modulus. As the stressing rate decreases, surface failures have greater influence in decreasing the Weibull modulus than volume failures.

UR - http://www.scopus.com/inward/record.url?scp=0032312556&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0032312556

SN - 0196-6219

VL - 19

SP - 79

EP - 87

JO - Ceramic Engineering and Science Proceedings

JF - Ceramic Engineering and Science Proceedings

IS - 4

T2 - Proceedings of the 1998 22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A. Part 1 (of 2)

Y2 - 20 January 1998 through 24 January 1998

ER -

Investigations of the Weibull modulus as a function of stressing rate

Abstract

Other files and links

Fingerprint

Cite this