Investigation of the via fill process for high density multilayer LTCC substrates

Brian Rowden, Gangqiang Wang, Fred Barlow, Aicha Elshabini, Larry Zawicki, Gregg Barrier, Brent Duncan, Dan Krueger, Cristie Lopez

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

High density electronic packaging for compact and multifunctional electronics demands micro rias for the vertical interconnects in multilayer substrates. With the capabilities of micro rias, fine lines, and large number of layers, low temperature cofired ceramic (LTCC) substrates have recently found wide applications in many industries such as automotive and wireless communication. However, filing micro vias down to 50 um in diameter with conductor ink presents challenges. Lnvestigation of the via fill process indicated that gold based via pastes presented increased difficulty in the injection via fill process as compared to the silver paste counterparts. A significant improvement in continuity related defects was observed with the 75 jam via geometries as compared to the 50 jam geometries for both silver and gold ink systems. The alignment error of via stacks among the printed layers appears to be less than 25 um, though misalignment on the order of 30 to 50 um was noted between the imprinted and printed layers.

Original languageEnglish
Title of host publicationProceedings - 2006 International Symposium on Microelectronics, IMAPS 2006
Pages926-931
Number of pages6
StatePublished - 2006
Externally publishedYes
Event39th International Symposium on Microelectronics, IMAPS 2006 - San Diego, CA, United States
Duration: Oct 8 2006Oct 12 2006

Publication series

NameProceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Conference

Conference39th International Symposium on Microelectronics, IMAPS 2006
Country/TerritoryUnited States
CitySan Diego, CA
Period10/8/0610/12/06

Keywords

  • And high density electronic packaging
  • Low temperature cofired ceramics (LTCC)
  • Micro vias
  • Via formation

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