TY - GEN
T1 - Investigation and comparison of cascaded H-bridge and modular multilevel converter topologies for medium-voltage drive application
AU - Marzoughi, Alinaghi
AU - Burgos, Rolando
AU - Boroyevich, Dushan
AU - Xue, Yaosuo
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/2/24
Y1 - 2014/2/24
N2 - This paper investigates the design procedure of cascaded H-bridge (CHB) and modular multilevel converter (MMC) topologies for medium-voltage and high-power industrial motor drive application. The design is performed using 1.7-kV insulated gate bipolar transistor (IGBT) technology. A model is derived for multi-pulse transformer to take into account its leakage parameters' effect on converter design. Also a comparison is done between MMC and CHB topologies at three different voltage levels: 4.16-, 6.9- and 13.8-kV and three different power levels: 1-, 3- and 5-MVA Comparison is done from several points of view like capacitance requirements, diode front-end and inverter stage losses, semiconductor rating and junction temperature and parts count.
AB - This paper investigates the design procedure of cascaded H-bridge (CHB) and modular multilevel converter (MMC) topologies for medium-voltage and high-power industrial motor drive application. The design is performed using 1.7-kV insulated gate bipolar transistor (IGBT) technology. A model is derived for multi-pulse transformer to take into account its leakage parameters' effect on converter design. Also a comparison is done between MMC and CHB topologies at three different voltage levels: 4.16-, 6.9- and 13.8-kV and three different power levels: 1-, 3- and 5-MVA Comparison is done from several points of view like capacitance requirements, diode front-end and inverter stage losses, semiconductor rating and junction temperature and parts count.
KW - Cascaded H-Bridge (CHB)
KW - Medium-Voltage High-Power Motor Drive
KW - Modular Multilevel Converter (MMC)
UR - http://www.scopus.com/inward/record.url?scp=84983140445&partnerID=8YFLogxK
U2 - 10.1109/IECON.2014.7048710
DO - 10.1109/IECON.2014.7048710
M3 - Conference contribution
AN - SCOPUS:84983140445
T3 - IECON Proceedings (Industrial Electronics Conference)
SP - 1562
EP - 1568
BT - IECON Proceedings (Industrial Electronics Conference)
PB - Institute of Electrical and Electronics Engineers Inc.
ER -