Interfacial thermal transport in spin caloritronic material systems

Frank Angeles, Qiyang Sun, Victor H. Ortiz, Jing Shi, Chen Li, Richard B. Wilson

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

Interfaces often govern the thermal performance of nanoscale devices and nanostructured materials. As a result, accurate knowledge of thermal interface conductance is necessary to model the temperature response of nanoscale devices or nanostructured materials to heating. Here, we report the thermal boundary conductance between metals and insulators that are commonly used in spin-caloritronic experiments. We use time-domain thermoreflectance to measure the interface conductance between metals such as Au, Pt, Ta, Cu, and Al with garnet and oxide substrates, e.g., NiO, yttrium iron garnet (YIG), thulium iron garnet (TmIG), Cr2O3, and sapphire. We find that, at room temperature, the interface conductance in these types of material systems range from 50 to 300MWm-2K-1. We also measure the interface conductance between Pt and YIG at temperatures between 80 and 350 K. At room temperature, the interface conductance of Pt/YIG is 170MWm-2K-1 and the Kapitza length is ∼40 nm. A Kapitza length of 40 nm means that, in the presence of a steady-state heat current, the temperature drop at the Pt/YIG interface is equal to the temperature drop across a 40-nm-thick layer of YIG. At 80 K, the interface conductance of Pt/YIG is 60MWm-2K-1, corresponding to a Kapitza length of ∼300 nm.

Original languageEnglish
Article number114403
JournalPhysical Review Materials
Volume5
Issue number11
DOIs
StatePublished - Nov 2021
Externally publishedYes

Funding

This work was primarily supported by the U.S. Army Research Laboratory and the U.S. Army Research Office under Contract/Grant No. W911NF-18-1-0364. Q.S. and C.L. are supported by the National Science Foundation under Grant No. 1750786. J.S. acknowledges DOE BES Award No. DE-FG02-07ER46351.

Fingerprint

Dive into the research topics of 'Interfacial thermal transport in spin caloritronic material systems'. Together they form a unique fingerprint.

Cite this