Interfacial reaction of Cu-Tie coating-polyimide flexible copper clad laminates

Jea Won Lee, In Seon Lee, Tae Won Kang, Dong Won Kim, Sang Ho Kim

Research output: Contribution to journalArticlepeer-review

Abstract

Adhesion of flexible copper clad laminates (FCCL) on two different types of polyimide (PI), sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI), were studied. Chromium (Cr), strongly reacts with dangling O bonds, was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Polyimide surfaces were pretreated with gas plasma that was generated with a mixture of argon and oxygen before sputtering process. Adhesion measurement was performed on these samples according to IPC specification. The results show that the peel strength of the FCCL on SRPI was higher than on CRPI. This is considered to be due to the formation of Cu-Cr-O solid solution at the metal- PI interface.

Original languageEnglish
Pages (from-to)1675-1678
Number of pages4
JournalKey Engineering Materials
Volume321-323 II
DOIs
StatePublished - 2006
Externally publishedYes

Keywords

  • CRPI
  • FCCL
  • Peel strength
  • SRPI
  • Tie-coating layer

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