Abstract
This paper reports evidence for enhanced elemental interdiffusion during ultrasonic additive manufacturing (UAM) across metal boundaries of copper-aluminum, nickel-gold, and nickel-gold-aluminum. The high solute interdiffusion measured by energy dispersive X-ray spectroscopy line scans is rationalized with calculated vacancy concentrations orders of magnitude larger than thermal equilibrium values. The above estimates are supported by existing knowledge related to defect physics and UAM thermal cycles. The observation of pronounced elemental mixing are evidence for the presence of enhanced non-equilibrium immiscible metal interdiffusion during UAM processing.
| Original language | English |
|---|---|
| Pages (from-to) | 1142-1157 |
| Number of pages | 16 |
| Journal | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science |
| Volume | 52 |
| Issue number | 3 |
| DOIs | |
| State | Published - Mar 2021 |
Funding
This research is sponsored by the Laboratory Directed Research and Development Program of Oak Ridge National Laboratory (ORNL), managed by UT-Battelle LLC, for the US Department of Energy. Adam Hehr and Mark Norfolk (Fabrisonic LLC, Columbus, Ohio) fabricated the embedded fiber samples. Dorothy Coffey assisted in TEM lamella fabrication. Metallography and optical microscopy were performed in the ORNL Manufacturing Demonstration Facility (MDF). SEM and EDS Bruker analysis were performed in the ORNL High Temperature Materials Laboratory (HTML). TEM was performed in the ORNL Low Activation Materials Development and Analysis Laboratory (LAMDA).
| Funders | Funder number |
|---|---|
| U.S. Department of Energy | |
| Oak Ridge National Laboratory | |
| UT-Battelle |
