Abstract
The mechanical properties of an acrylate resin and its carbon fiber composite, as well as the adhesion strength between them, were characterized in the case of thermal and electron beam curing (with and without thermal post-cure). It was shown that the properties of the matrix were similar but that the thermal history during the curing had a direct influence on the type of interactions that were generated at the interface, leading to different level of adhesion strength and level of performance for the associated composites. In the case of a thermal cure, the thermal profile allowed the generation of covalent bonding at the interface by thermal degradation of carboxylic acid functionalities and simultaneous production of radicals at the surface of the fiber. A high level of adhesion strength was obtained, which was not the case for electron beam curing without a thermal post-cure at the appropriate temperature.
Original language | English |
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Pages (from-to) | 162-172 |
Number of pages | 11 |
Journal | Composites - Part A: Applied Science and Manufacturing |
Volume | 45 |
DOIs | |
State | Published - Feb 1 2013 |
Funding
This research was partially sponsored by the U.S. Department of Energy, Assistant Secretary for Energy Efficiency and Renewable Energy, Office of Vehicle Technologies, as part of the Lightweighting Materials. A part of this research was done through the SHared Research Equipment (SHaRE) User Facility operated for the U.S. Department of Energy Office of Science by the Oak Ridge National Laboratory. Cytec Industries Inc. is sincerely acknowledged for the providing of Ebecryl 600®. Jamie Messman (Center for Nanophase Materials Sciences, Oak Ridge National Laboratory) is gratefully thanked for his assistance with the use of the FTIR spectrometer.
Funders | Funder number |
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U.S. Department of Energy | |
Office of Energy Efficiency and Renewable Energy | |
Oak Ridge National Laboratory | |
Vehicle Technologies Office |
Keywords
- A. Carbon fibers
- A. Polymer-matrix composites (PMCs)
- B. Fiber/matrix bond
- B. Interface