TY - GEN
T1 - In tegration of carbon nanostructures on CMOS for lab-on-a-chip sensing
AU - Mamun, Khandaker A.Al
AU - Gu, Jinlong
AU - Hensley, Dale K.
AU - Islam, Syed K.
AU - McFarlane, Nicole
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/7/29
Y1 - 2016/7/29
N2 - We review the challenges and suggest future directions of carbon nanostructure CMOS integration for lab-on-a-chip systems. Power and area requirements of standard benchtop sensor instrumentation limits their use in portable applications. We have been developing carbon based nanostructures and low power analog readouts to enable sensitive and highly efficient sensor measurement in a single measurement platform. Specifically, we review integration methods for carbon nanofibers and nanospikes with sensor readouts on a CMOS platform. These lab-on-chip systems offer high throughput, require low operating power and allow complete system implementation in portable and implantable devices.
AB - We review the challenges and suggest future directions of carbon nanostructure CMOS integration for lab-on-a-chip systems. Power and area requirements of standard benchtop sensor instrumentation limits their use in portable applications. We have been developing carbon based nanostructures and low power analog readouts to enable sensitive and highly efficient sensor measurement in a single measurement platform. Specifically, we review integration methods for carbon nanofibers and nanospikes with sensor readouts on a CMOS platform. These lab-on-chip systems offer high throughput, require low operating power and allow complete system implementation in portable and implantable devices.
UR - http://www.scopus.com/inward/record.url?scp=84983455627&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2016.7539194
DO - 10.1109/ISCAS.2016.7539194
M3 - Conference contribution
AN - SCOPUS:84983455627
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 2879
EP - 2882
BT - ISCAS 2016 - IEEE International Symposium on Circuits and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
Y2 - 22 May 2016 through 25 May 2016
ER -