@inproceedings{105f28611127449b9287a7330944c793,
title = "Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging",
abstract = "TPG-core IMS concept was jointly explored in this study. Integrating high thermally conductive Thermal Pyrolytic Graphite (TPG) core into Insulated Metal Substrate (IMS) is expected to simultaneously achieve high thermal conductivity from TPG and electrical functionalities from IMS. Nearly 2x thermal conductivity and 30% weight saving was demonstrated on TPG-core IMS compared to conventional Cu-core IMS. Significant junction temperature reduction (11oC) in steady state and power cycling was revealed by the thermal analysis as the result of improved thermal spreading in plane and through the thickness. The study also proved the manufacturability and compatibility of this TPG-core IMS structure to the existing IMS production and power module assembling. The integration of TPG and IMS paves a new packaging route to increase heat load, improve reliability, simplify module design and reduce assembling cost and number of steps.",
keywords = "Breakdown voltage, DBC, Dielectric, IMS, Junction temperature, MCPCB, Power module, SiC MOSFET, TPG, Thermal conductivity",
author = "Wei Fan and Garry Wexler and Emre Gurpinar and Burak Ozpineci",
note = "Publisher Copyright: {\textcopyright} 2020 Trans Tech Publications Ltd, Switzerland.; 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019 ; Conference date: 29-09-2019 Through 04-10-2019",
year = "2020",
doi = "10.4028/www.scientific.net/MSF.1004.1022",
language = "English",
isbn = "9783035715798",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "1022--1026",
editor = "Hiroshi Yano and Takeshi Ohshima and Kazuma Eto and Takeshi Mitani and Shinsuke Harada and Yasunori Tanaka",
booktitle = "Silicon Carbide and Related Materials 2019",
}