Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging

Wei Fan; Garry Wexler; Emre Gurpinar; Burak Ozpineci

doi:10.4028/www.scientific.net/MSF.1004.1022

Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging

Wei Fan, Garry Wexler, Emre Gurpinar, Burak Ozpineci

Buildings and Transportation Science Div

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

TPG-core IMS concept was jointly explored in this study. Integrating high thermally conductive Thermal Pyrolytic Graphite (TPG) core into Insulated Metal Substrate (IMS) is expected to simultaneously achieve high thermal conductivity from TPG and electrical functionalities from IMS. Nearly 2x thermal conductivity and 30% weight saving was demonstrated on TPG-core IMS compared to conventional Cu-core IMS. Significant junction temperature reduction (11^oC) in steady state and power cycling was revealed by the thermal analysis as the result of improved thermal spreading in plane and through the thickness. The study also proved the manufacturability and compatibility of this TPG-core IMS structure to the existing IMS production and power module assembling. The integration of TPG and IMS paves a new packaging route to increase heat load, improve reliability, simplify module design and reduce assembling cost and number of steps.

Original language	English
Title of host publication	Silicon Carbide and Related Materials 2019
Editors	Hiroshi Yano, Takeshi Ohshima, Kazuma Eto, Takeshi Mitani, Shinsuke Harada, Yasunori Tanaka
Publisher	Trans Tech Publications Ltd
Pages	1022-1026
Number of pages	5
ISBN (Print)	9783035715798
DOIs	https://doi.org/10.4028/www.scientific.net/MSF.1004.1022
State	Published - 2020
Event	18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019 - Kyoto, Japan Duration: Sep 29 2019 → Oct 4 2019

Publication series

Name	Materials Science Forum
Volume	1004 MSF
ISSN (Print)	0255-5476
ISSN (Electronic)	1662-9752

Conference

Conference	18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019
Country/Territory	Japan
City	Kyoto
Period	09/29/19 → 10/4/19

Funding

This manuscript has been authored in part by UT-Battelle, LLC, under contract DE-AC05-00OR22725 with the US Department of Energy (DOE). The US government retains and the publisher, by accepting the article for publication, acknowledges that the US government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this manuscript, or allow others to do so, for US government purposes. DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (http://energy.gov/downloads/doe-public-access-plan).

Funders	Funder number
DOE Public Access Plan
US Department of Energy
U.S. Department of Energy

Keywords

Breakdown voltage
DBC
Dielectric
IMS
Junction temperature
MCPCB
Power module
SiC MOSFET
TPG
Thermal conductivity

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.4028/www.scientific.net/MSF.1004.1022

Cite this

Fan, W., Wexler, G., Gurpinar, E., & Ozpineci, B. (2020). Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging. In H. Yano, T. Ohshima, K. Eto, T. Mitani, S. Harada, & Y. Tanaka (Eds.), Silicon Carbide and Related Materials 2019 (pp. 1022-1026). (Materials Science Forum; Vol. 1004 MSF). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.1004.1022

Fan, Wei ; Wexler, Garry ; Gurpinar, Emre et al. / Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging. Silicon Carbide and Related Materials 2019. editor / Hiroshi Yano ; Takeshi Ohshima ; Kazuma Eto ; Takeshi Mitani ; Shinsuke Harada ; Yasunori Tanaka. Trans Tech Publications Ltd, 2020. pp. 1022-1026 (Materials Science Forum).

@inproceedings{105f28611127449b9287a7330944c793,

title = "Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging",

abstract = "TPG-core IMS concept was jointly explored in this study. Integrating high thermally conductive Thermal Pyrolytic Graphite (TPG) core into Insulated Metal Substrate (IMS) is expected to simultaneously achieve high thermal conductivity from TPG and electrical functionalities from IMS. Nearly 2x thermal conductivity and 30% weight saving was demonstrated on TPG-core IMS compared to conventional Cu-core IMS. Significant junction temperature reduction (11oC) in steady state and power cycling was revealed by the thermal analysis as the result of improved thermal spreading in plane and through the thickness. The study also proved the manufacturability and compatibility of this TPG-core IMS structure to the existing IMS production and power module assembling. The integration of TPG and IMS paves a new packaging route to increase heat load, improve reliability, simplify module design and reduce assembling cost and number of steps.",

keywords = "Breakdown voltage, DBC, Dielectric, IMS, Junction temperature, MCPCB, Power module, SiC MOSFET, TPG, Thermal conductivity",

author = "Wei Fan and Garry Wexler and Emre Gurpinar and Burak Ozpineci",

note = "Publisher Copyright: {\textcopyright} 2020 Trans Tech Publications Ltd, Switzerland.; 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019 ; Conference date: 29-09-2019 Through 04-10-2019",

year = "2020",

doi = "10.4028/www.scientific.net/MSF.1004.1022",

language = "English",

isbn = "9783035715798",

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Fan, W, Wexler, G, Gurpinar, E & Ozpineci, B 2020, Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging. in H Yano, T Ohshima, K Eto, T Mitani, S Harada & Y Tanaka (eds), Silicon Carbide and Related Materials 2019. Materials Science Forum, vol. 1004 MSF, Trans Tech Publications Ltd, pp. 1022-1026, 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019, Kyoto, Japan, 09/29/19. https://doi.org/10.4028/www.scientific.net/MSF.1004.1022

Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging. / Fan, Wei; Wexler, Garry; Gurpinar, Emre et al.
Silicon Carbide and Related Materials 2019. ed. / Hiroshi Yano; Takeshi Ohshima; Kazuma Eto; Takeshi Mitani; Shinsuke Harada; Yasunori Tanaka. Trans Tech Publications Ltd, 2020. p. 1022-1026 (Materials Science Forum; Vol. 1004 MSF).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging

AU - Fan, Wei

AU - Wexler, Garry

AU - Gurpinar, Emre

AU - Ozpineci, Burak

PY - 2020

Y1 - 2020

N2 - TPG-core IMS concept was jointly explored in this study. Integrating high thermally conductive Thermal Pyrolytic Graphite (TPG) core into Insulated Metal Substrate (IMS) is expected to simultaneously achieve high thermal conductivity from TPG and electrical functionalities from IMS. Nearly 2x thermal conductivity and 30% weight saving was demonstrated on TPG-core IMS compared to conventional Cu-core IMS. Significant junction temperature reduction (11oC) in steady state and power cycling was revealed by the thermal analysis as the result of improved thermal spreading in plane and through the thickness. The study also proved the manufacturability and compatibility of this TPG-core IMS structure to the existing IMS production and power module assembling. The integration of TPG and IMS paves a new packaging route to increase heat load, improve reliability, simplify module design and reduce assembling cost and number of steps.

AB - TPG-core IMS concept was jointly explored in this study. Integrating high thermally conductive Thermal Pyrolytic Graphite (TPG) core into Insulated Metal Substrate (IMS) is expected to simultaneously achieve high thermal conductivity from TPG and electrical functionalities from IMS. Nearly 2x thermal conductivity and 30% weight saving was demonstrated on TPG-core IMS compared to conventional Cu-core IMS. Significant junction temperature reduction (11oC) in steady state and power cycling was revealed by the thermal analysis as the result of improved thermal spreading in plane and through the thickness. The study also proved the manufacturability and compatibility of this TPG-core IMS structure to the existing IMS production and power module assembling. The integration of TPG and IMS paves a new packaging route to increase heat load, improve reliability, simplify module design and reduce assembling cost and number of steps.

KW - Breakdown voltage

KW - DBC

KW - Dielectric

KW - IMS

KW - Junction temperature

KW - MCPCB

KW - Power module

KW - SiC MOSFET

KW - TPG

KW - Thermal conductivity

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DO - 10.4028/www.scientific.net/MSF.1004.1022

M3 - Conference contribution

AN - SCOPUS:85089821280

SN - 9783035715798

T3 - Materials Science Forum

SP - 1022

EP - 1026

BT - Silicon Carbide and Related Materials 2019

A2 - Yano, Hiroshi

A2 - Ohshima, Takeshi

A2 - Eto, Kazuma

A2 - Mitani, Takeshi

A2 - Harada, Shinsuke

A2 - Tanaka, Yasunori

PB - Trans Tech Publications Ltd

T2 - 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019

Y2 - 29 September 2019 through 4 October 2019

ER -

Fan W, Wexler G, Gurpinar E, Ozpineci B. Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging. In Yano H, Ohshima T, Eto K, Mitani T, Harada S, Tanaka Y, editors, Silicon Carbide and Related Materials 2019. Trans Tech Publications Ltd. 2020. p. 1022-1026. (Materials Science Forum). doi: 10.4028/www.scientific.net/MSF.1004.1022

Improving heat conduction of insulated metal substrate with thermal pyrolytic graphite core for sic power module packaging

Abstract

Publication series

Conference

Funding

Keywords

UN SDGs

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