Abstract
Composite thick films of YBa2Cu3O7-x and silver have been prepared on alumina substrates using a paint-on method. It is found that thick films containing greater than about 10% silver by weight have greatly reduced normal resistivities for T>Tc (onset) and significantly enhanced Tc (R=0) as compared with undoped films processed under identical conditions. These results are interpreted in terms of enhanced grain growth and an improved coupling between grain boundaries because of proximity-induced electron pairing in the silver regions.
| Original language | English |
|---|---|
| Pages (from-to) | 2256-2258 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 54 |
| Issue number | 22 |
| DOIs | |
| State | Published - 1989 |
| Externally published | Yes |