Improvement of YBa2Cu3O7-x thick films by doping with silver

J. H. Miller; S. L. Holder; J. D. Hunn; G. N. Holder

doi:10.1063/1.101518

Improvement of YBa₂Cu₃O_7-x thick films by doping with silver

J. H. Miller, S. L. Holder, J. D. Hunn, G. N. Holder

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49 Scopus citations

Abstract

Composite thick films of YBa₂Cu₃O_7-x and silver have been prepared on alumina substrates using a paint-on method. It is found that thick films containing greater than about 10% silver by weight have greatly reduced normal resistivities for T>T_c (onset) and significantly enhanced T_c (R=0) as compared with undoped films processed under identical conditions. These results are interpreted in terms of enhanced grain growth and an improved coupling between grain boundaries because of proximity-induced electron pairing in the silver regions.

Original language	English
Pages (from-to)	2256-2258
Number of pages	3
Journal	Applied Physics Letters
Volume	54
Issue number	22
DOIs	https://doi.org/10.1063/1.101518
State	Published - 1989
Externally published	Yes

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title = "Improvement of YBa2Cu3O7-x thick films by doping with silver",

abstract = "Composite thick films of YBa2Cu3O7-x and silver have been prepared on alumina substrates using a paint-on method. It is found that thick films containing greater than about 10% silver by weight have greatly reduced normal resistivities for T>Tc (onset) and significantly enhanced Tc (R=0) as compared with undoped films processed under identical conditions. These results are interpreted in terms of enhanced grain growth and an improved coupling between grain boundaries because of proximity-induced electron pairing in the silver regions.",

author = "Miller, {J. H.} and Holder, {S. L.} and Hunn, {J. D.} and Holder, {G. N.}",

year = "1989",

doi = "10.1063/1.101518",

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journal = "Applied Physics Letters",

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T1 - Improvement of YBa2Cu3O7-x thick films by doping with silver

AU - Miller, J. H.

AU - Holder, S. L.

AU - Hunn, J. D.

AU - Holder, G. N.

PY - 1989

Y1 - 1989

N2 - Composite thick films of YBa2Cu3O7-x and silver have been prepared on alumina substrates using a paint-on method. It is found that thick films containing greater than about 10% silver by weight have greatly reduced normal resistivities for T>Tc (onset) and significantly enhanced Tc (R=0) as compared with undoped films processed under identical conditions. These results are interpreted in terms of enhanced grain growth and an improved coupling between grain boundaries because of proximity-induced electron pairing in the silver regions.

AB - Composite thick films of YBa2Cu3O7-x and silver have been prepared on alumina substrates using a paint-on method. It is found that thick films containing greater than about 10% silver by weight have greatly reduced normal resistivities for T>Tc (onset) and significantly enhanced Tc (R=0) as compared with undoped films processed under identical conditions. These results are interpreted in terms of enhanced grain growth and an improved coupling between grain boundaries because of proximity-induced electron pairing in the silver regions.

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DO - 10.1063/1.101518

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JF - Applied Physics Letters

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ER -

Improvement of YBa₂Cu₃O_7-x thick films by doping with silver

Abstract

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