Abstract
The use of ITO interlayers between Ga2O3 and Ti/Au metallization is shown to produce Ohmic contacts after annealing in the range of 500-600 °C. Without the ITO, similar anneals do not lead to linear current-voltage characteristics. Transmission line measurements were used to extract the specific contact resistance of the Au/Ti/ITO/Ga2O3 stacks as a function of annealing temperature. Sheet, specific contact, and transfer resistances all decreased sharply from as-deposited values with annealing. The minimum transfer resistance and specific contact resistance of 0.60 Ω mm and 6.3 × 10-5 Ω cm2 were achieved after 600 °C annealing, respectively. The conduction band offset between ITO and Ga2O3 is 0.32 eV and is consistent with the improved electron transport across the heterointerface.
Original language | English |
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Article number | 061201 |
Journal | Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics |
Volume | 35 |
Issue number | 6 |
DOIs | |
State | Published - Nov 1 2017 |
Funding
The project or effort depicted was also sponsored by the Department of the Defense, Defense Threat Reduction Agency, HDTRA1-17-1-011, monitored by Jacob Calkins. A portion of this research was conducted at the Center for Nanophase Materials Sciences, which is sponsored at Oak Ridge National Laboratory by the Office of Basic Energy Sciences, U.S. Department of Energy. The content of the information does not necessarily reflect the position or the policy of the federal government, and no official endorsement should be inferred. Part of the work at Tamura was supported by “The research and development project for innovation technique of energy conservation” of the New
Funders | Funder number |
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Department of the Defense | |
Office of Basic Energy Sciences | |
U.S. Department of Energy | |
Defense Threat Reduction Agency | HDTRA1-17-1-011 |
Oak Ridge National Laboratory |