Abstract
Recently, organometallic halide perovskites (OMHPs) have attracted much interest as a potential medium resolution detector for ionizing radiation sensing applications. Despite moderate success in the development of OMHP radiation detectors to date, efforts to optimize bulk carrier properties are often hindered by device degradation caused by surface recombination, ionic conductivity, environmental instability, and interface phenomena. In this study, methods of improving the interfacial and surface properties, detector stability, and responsivity of methylammonium lead tribromide (MAPB) semiconductor radiation detectors were investigated. We demonstrated that chemomechanical polishing with dimethylformamide (DMF) as a finishing step decreased surface roughness, removed surface trap states, and greatly enhanced device stability compared to mechanical polishing. Further, using a tin oxide (SnO2) interface layer as hole blocking/electron transporting layer greatly increased the device fabrication success rate and helped mitigate the effect of ion migration reactions with metallic contacts. These post-growth processing techniques resulted in the first electron response of a MAPB detector exposed to alpha particles.
| Original language | English |
|---|---|
| Article number | 164710 |
| Journal | Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment |
| Volume | 986 |
| DOIs | |
| State | Published - Jan 11 2021 |
| Externally published | Yes |
Funding
This material is based upon work supported by the U.S. Department of Homeland Security under grant no. 16DNARI00018-04-0. Part of this work was conducted in the Micro-Processing Research Facility, a University of Tennessee Core Facility. Disclaimer: The views and conclusions contained in this document are those of the authors and should not be interpreted as necessarily representing the official policies, either expressed or implied, of the U.S. Department of Homeland Security. This material is based upon work supported by the U.S. Department of Homeland Security under grant no. 16DNARI00018-04-0 . Part of this work was conducted in the Micro-Processing Research Facility, a University of Tennessee Core Facility. Disclaimer: The views and conclusions contained in this document are those of the authors and should not be interpreted as necessarily representing the official policies, either expressed or implied, of the U.S. Department of Homeland Security.
Keywords
- Chemomechanical polishing
- Methylammonium lead bromide
- Perovskite
- Radiation detection
- Tin oxide
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