Improved off-state stress critical voltage on AlGaN/GaN high electron mobility transistors utilizing Pt/Ti/Au based gate metallization

C. F. Lo, L. Liu, T. S. Kang, R. Davies, B. P. Gila, S. J. Pearton, I. I. Kravchenko, O. Laboutin, Y. Cao, W. J. Johnson, F. Ren

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

The critical voltage for degradation of AlGaN/GaN high electron mobility transistors (HEMTs) employed with the Pt/Ti/Au gate metallization instead of the commonly used Ni/Au was significantly increased during the off-state stress. The typical critical voltage for HEMTs with Ni/Au gate metallization was around -60V. By sharp contrast, no critical voltage was observed for the HEMTs with Pt/Ti/Au gate metallization, even up to -100V, which was the instrumental limitation in this experiment. Both Schottky forward and reverse gate characteristics of the Ni/Au degraded once the gate voltage passed the critical voltage of around -60V. There was no degradation exhibited for the HEMTs with Pt-gated HEMTs.

Original languageEnglish
Title of host publicationState-of-the-Art Program on Compound Semiconductors 53, SOTAPOCS 53
PublisherElectrochemical Society Inc.
Pages63-70
Number of pages8
Edition6
ISBN (Electronic)9781607682608
ISBN (Print)9781566779067
DOIs
StatePublished - 2011
EventState-of-the-Art Program on Compound Semiconductors 53, SOTAPOCS 53 - 220th ECS Meeting - Boston, MA, United States
Duration: Oct 9 2011Oct 14 2011

Publication series

NameECS Transactions
Number6
Volume41
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceState-of-the-Art Program on Compound Semiconductors 53, SOTAPOCS 53 - 220th ECS Meeting
Country/TerritoryUnited States
CityBoston, MA
Period10/9/1110/14/11

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