Impact of power factor correction and harmonic compensation by STATCOM on converter temperature

Lakshmi GopiReddy, Leon M. Tolbert, Burak Ozpineci, Yan Xu, Tom Rizy

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

Most of the failures in IGBTs are caused by thermal fatigue. Hence, the thermal analysis of IGBTs for each particular application is an important step in determining their lifetime. In this paper, the thermal analysis of a STATCOM is presented for two different applications, power factor correction and harmonic elimination. The STATCOM model is developed in EMTP for the above mentioned functions. The analytical equations for average conduction losses in an IGBT and a diode are derived. The electrothermal model is used to estimate the temperature of the IGBT. A comparative analysis of the thermal stresses on the IGBT with various parameters such as power factor, harmonic frequency, and harmonic amplitude is presented as a basis for future reliability testing of IGBTs in FACTS applications.

Original languageEnglish
Title of host publicationIEEE Energy Conversion Congress and Exposition
Subtitle of host publicationEnergy Conversion Innovation for a Clean Energy Future, ECCE 2011, Proceedings
Pages1928-1934
Number of pages7
DOIs
StatePublished - 2011
Event3rd Annual IEEE Energy Conversion Congress and Exposition, ECCE 2011 - Phoenix, AZ, United States
Duration: Sep 17 2011Sep 22 2011

Publication series

NameIEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, ECCE 2011, Proceedings

Conference

Conference3rd Annual IEEE Energy Conversion Congress and Exposition, ECCE 2011
Country/TerritoryUnited States
CityPhoenix, AZ
Period09/17/1109/22/11

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