TY - GEN
T1 - Impact of Heat Dissipation Profiles on Power Electronics Packaging Design
AU - Wu, Tong
AU - Ozpineci, Burak
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/8/28
Y1 - 2018/8/28
N2 - This paper focuses on understanding the thermal impacts of using discrete power devices and limitations of applying conventional thermal design methods. Empirically, a thermal system is designed based on selecting a heat sink with the required thermal resistance from the manufacturer datasheet. This method, as an approximate estimation, has been proven effective as a rough design of Si-based power module. However, wide bandgap (WBG) bare dies bring additional thermal design concerns that have been overlooked. The benefits of WBG devices, such as smaller chip sizes and higher power ratings, on the other hand, lead to thermal concentration issues. Detailed analyses and impacts of the thermal concentration are presented in this paper. A more accurate model involving Finite Element Analysis (FEA) and Genetic Algorithm optimization is also proposed for a more accurate thermal design.
AB - This paper focuses on understanding the thermal impacts of using discrete power devices and limitations of applying conventional thermal design methods. Empirically, a thermal system is designed based on selecting a heat sink with the required thermal resistance from the manufacturer datasheet. This method, as an approximate estimation, has been proven effective as a rough design of Si-based power module. However, wide bandgap (WBG) bare dies bring additional thermal design concerns that have been overlooked. The benefits of WBG devices, such as smaller chip sizes and higher power ratings, on the other hand, lead to thermal concentration issues. Detailed analyses and impacts of the thermal concentration are presented in this paper. A more accurate model involving Finite Element Analysis (FEA) and Genetic Algorithm optimization is also proposed for a more accurate thermal design.
KW - Junction temperature
KW - Modeling
KW - TEC
KW - Thermal coupling
KW - Thermal management
UR - http://www.scopus.com/inward/record.url?scp=85053845453&partnerID=8YFLogxK
U2 - 10.1109/ITEC.2018.8450200
DO - 10.1109/ITEC.2018.8450200
M3 - Conference contribution
AN - SCOPUS:85053845453
SN - 9781538630488
T3 - 2018 IEEE Transportation and Electrification Conference and Expo, ITEC 2018
SP - 1082
EP - 1087
BT - 2018 IEEE Transportation and Electrification Conference and Expo, ITEC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE Transportation and Electrification Conference and Expo, ITEC 2018
Y2 - 13 June 2018 through 15 June 2018
ER -