TY - GEN
T1 - High voltage, high power density bi-directional multi-level converters utilizing silicon and silicon carbide (SiC) switches
AU - Reese, Bradley
AU - Schupbach, Marcelo
AU - Lostetter, Alex
AU - Rowden, Brian
AU - Saunders, Robert
AU - Balda, Juan
PY - 2008
Y1 - 2008
N2 - This paper presents a bi-directional ac-dc isolated converter designed to be utilized within the US Navy's Integrated Fight Through Power (IFTP) concept. To demonstrate the proposed approach the authors have designed, fabricated, and tested a 20 kW Power Conversion Module (PCM) prototype. The fabricated PCM module was used to demonstrate the proposed overall electrical design approach, high-frequency isolation, bidirectional power flow and soft-switching operation of the quasiresonant topologies. Moreover, the 20-kW prototype allowed the verification of control methodologies as well as magnetic and thermal designs, and provides a test bed for future, higher power work.
AB - This paper presents a bi-directional ac-dc isolated converter designed to be utilized within the US Navy's Integrated Fight Through Power (IFTP) concept. To demonstrate the proposed approach the authors have designed, fabricated, and tested a 20 kW Power Conversion Module (PCM) prototype. The fabricated PCM module was used to demonstrate the proposed overall electrical design approach, high-frequency isolation, bidirectional power flow and soft-switching operation of the quasiresonant topologies. Moreover, the 20-kW prototype allowed the verification of control methodologies as well as magnetic and thermal designs, and provides a test bed for future, higher power work.
UR - http://www.scopus.com/inward/record.url?scp=49249098627&partnerID=8YFLogxK
U2 - 10.1109/APEC.2008.4522730
DO - 10.1109/APEC.2008.4522730
M3 - Conference contribution
AN - SCOPUS:49249098627
SN - 9781424418749
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 252
EP - 258
BT - 2008 23rd Annual IEEE Applied Power Electronics Conference and Exposition, APEC
T2 - 2008 23rd Annual IEEE Applied Power Electronics Conference and Exposition, APEC
Y2 - 24 February 2008 through 28 February 2008
ER -